Ron R. Legario

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New Brunswick, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit assembly with cushion polymer layer
- Patent number 9,362,223
- Issue date Jun 7, 2016
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with cushion polymer layer
- Patent number 9,209,128
- Issue date Dec 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER
- Publication number 20150357283
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER
- Publication number 20150279779
- Publication date Oct 1, 2015
- Hitachi Chemical DuPont Microsystems, L.L.C.
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS