Ronald A. Kaschak

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of a metallic interlocking structure
- Patent number 6,693,031
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic interlocking structure
- Patent number 6,348,737
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Product formed by method of controlling resistivity of plated metal
- Patent number 5,334,461
- Issue date Aug 2, 1994
- International Business Machines, Inc.
- Melanie A. Day
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical and/or thermal interconnections and methods for obtainin...
- Patent number 5,189,261
- Issue date Feb 23, 1993
- IBM Corporation
- Lawrence C. Alexander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen, with...
- Patent number 4,967,690
- Issue date Nov 6, 1990
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper deposition from electroless plating bath
- Patent number 4,904,506
- Issue date Feb 27, 1990
- International Business Machines Corporation
- Peter A. Burnett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of controlling resistivity of plated metal and product forme...
- Patent number 4,756,923
- Issue date Jul 12, 1988
- International Business Machines Corp.
- Melanie A. Day
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper plating
- Patent number 4,707,377
- Issue date Nov 17, 1987
- International Business Machines Corporation
- Robert J. Capwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen
- Patent number 4,684,545
- Issue date Aug 4, 1987
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for controlling plating rate in an electroless plating system
- Patent number 4,623,554
- Issue date Nov 18, 1986
- International Business Machines Corp.
- Ronald A. Kaschak
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for plating from an electroless plating bath
- Patent number 4,554,184
- Issue date Nov 19, 1985
- International Business Machines Corporation
- Michael J. Canestaro
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of a metal from an electroless plating composition
- Patent number 4,552,787
- Issue date Nov 12, 1985
- International Business Machines Corporation
- Paul Chebiniak
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Formation of a metallic interlocking structure
- Publication number 20020056890
- Publication date May 16, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS

Ronald A. Kaschak

Person

Patents Grantslast 30 patents

Formation of a metallic interlocking structure

Metallic interlocking structure

Product formed by method of controlling resistivity of plated metal

Electrical and/or thermal interconnections and methods for obtainin...

Electroless plating with bi-level control of dissolved oxygen, with...

Copper deposition from electroless plating bath

Method of controlling resistivity of plated metal and product forme...

Copper plating

Electroless plating with bi-level control of dissolved oxygen

Method for controlling plating rate in an electroless plating system

Method for plating from an electroless plating bath

Deposition of a metal from an electroless plating composition

Patents Applicationslast 30 patents

Formation of a metallic interlocking structure