Ronald A. Norell

Person

Oceanside, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit tester having a fail-safe mechanism for moving I...
- Patent number 6,581,486
- Issue date Jun 24, 2003
- Unisys Corporation
- David John Ditri
- G01 - MEASURING TESTING
Information Patent Grant
Process for recycling a substrate from an integrated circuit package
- Patent number 6,271,048
- Issue date Aug 7, 2001
- Unisys Corporation
- Kenneth Patrick Reilich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of casting I/O columns on an electronic component with a hig...
- Patent number 6,105,851
- Issue date Aug 22, 2000
- Ronald Allen Norell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming I/O columns with open ends that are free of crate...
- Patent number 5,918,516
- Issue date Jul 6, 1999
- Unisys Corporation
- Ronald Allen Norell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrating template method of placing solder balls on the I/O pads o...
- Patent number 5,839,191
- Issue date Nov 24, 1998
- Unisys Corporation
- Kenneth Walter Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin block method of dispensing solder flux onto the I/O pads of an...
- Patent number 5,816,481
- Issue date Oct 6, 1998
- Unisys Corporation
- Kenneth Walter Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical assembly having a lid which protects IC chips and...
- Patent number 5,724,229
- Issue date Mar 3, 1998
- Unisys Corporation
- Jerry Ihor Tustaniwskyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer module incorporating liquid metal squeezed from a com...
- Patent number 5,572,404
- Issue date Nov 5, 1996
- Unisys Corporation
- Wilbur T. Layton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer sub-assembly incorporating liquid metal surrounded by...
- Patent number 5,561,590
- Issue date Oct 1, 1996
- Unisys Corporation
- Ronald A. Norell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing I/O terminals on I/O pads
- Patent number 5,454,159
- Issue date Oct 3, 1995
- Unisys Corporation
- Ronald A. Norell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via hole punch
- Patent number 5,303,618
- Issue date Apr 19, 1994
- Ronald A. Norell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming holes in unfired ceramic layers of integrated cir...
- Patent number 5,087,396
- Issue date Feb 11, 1992
- Unisys Corporation
- Gordon O. Zablotny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress multichip module
- Patent number 5,075,765
- Issue date Dec 24, 1991
- Unisys
- Ronald A. Norell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy-glass integrated circuit package having bonding pads in a ste...
- Patent number 4,643,935
- Issue date Feb 17, 1987
- Burroughs Corporation
- Norman E. McNeal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic bladder method of fabricating an integrated circuit package...
- Patent number 4,636,275
- Issue date Jan 13, 1987
- Burroughs Corporation
- Ronald A. Norell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine for filling via holes in an integrated circuit package with...
- Patent number 4,519,760
- Issue date May 28, 1985
- Burroughs Corporation
- Ronald A. Norell
- H01 - BASIC ELECTRIC ELEMENTS

Ronald A. Norell

Person

Patents Grantslast 30 patents

Integrated circuit tester having a fail-safe mechanism for moving I...

Process for recycling a substrate from an integrated circuit package

Method of casting I/O columns on an electronic component with a hig...

Method of forming I/O columns with open ends that are free of crate...

Vibrating template method of placing solder balls on the I/O pads o...

Pin block method of dispensing solder flux onto the I/O pads of an...

Electromechanical assembly having a lid which protects IC chips and...

Heat transfer module incorporating liquid metal squeezed from a com...

Heat transfer sub-assembly incorporating liquid metal surrounded by...

Method of manufacturing I/O terminals on I/O pads

Via hole punch

Method of forming holes in unfired ceramic layers of integrated cir...

Low stress multichip module

Epoxy-glass integrated circuit package having bonding pads in a ste...

Elastic bladder method of fabricating an integrated circuit package...

Machine for filling via holes in an integrated circuit package with...