Ronald D. Goldblatt

Person

Voorheesville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 10,199,516
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 9,716,192
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance, low reflection, and low cost contact grids for phot...
- Patent number 9,666,749
- Issue date May 30, 2017
- International Business Machines Corporation
- Ronald D. Goldblatt
- E04 - BUILDING
Information Patent Grant
Low resistance, low reflection, and low cost contact grids for phot...
- Patent number 9,337,363
- Issue date May 10, 2016
- International Business Machines Corporation
- Ronald Goldblatt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Device select system for multi-device electronic system
- Patent number 9,300,284
- Issue date Mar 29, 2016
- GLOBALFOUNDRIES Inc.
- Robert Glenn Biskeborn
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating a wire bond pad with Ni/Au metallization
- Patent number 7,294,565
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-functional structure for enhanced chip manufacturibility and...
- Patent number 7,098,676
- Issue date Aug 29, 2006
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common ball-limiting metallurgy for I/O sites
- Patent number 6,534,863
- Issue date Mar 18, 2003
- International Business Machines Corporation
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper seed layer repair technique using electroless touch-up
- Patent number 6,395,164
- Issue date May 28, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of annealing copper metallurgy
- Patent number 6,339,022
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Arne W. Ballantine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method/structure for creating aluminum wirebound pad on copper BEOL
- Patent number 6,333,559
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method/structure for creating aluminum wirebound pad on copper BEOL
- Patent number 6,187,680
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive surface functionalization
- Patent number 5,357,005
- Issue date Oct 18, 1994
- International Business Machines Corporation
- Stephen L. Buchwalter
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for producing a metal organic polymer combination
- Patent number 5,340,451
- Issue date Aug 23, 1994
- International Business Machines Corporation
- Leena P. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lamination method for coating the sidewall or filling a cavity in a...
- Patent number 5,208,068
- Issue date May 4, 1993
- International Business Machines Corporation
- Charles R. Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Means of seeding and metallizing polymide
- Patent number 5,178,914
- Issue date Jan 12, 1993
- International Business Machines Corp.
- Ronald D. Goldblatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for enhancing the adhesion of polymer surfaces by water vapo...
- Patent number 5,019,210
- Issue date May 28, 1991
- International Business Machines Corporation
- Ned J. Chou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...
- Publication number 20170309760
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE, LOW REFLECTION, AND LOW COST CONTACT GRIDS FOR PHOT...
- Publication number 20160225934
- Publication date Aug 4, 2016
- International Business Machines Corporation
- Ronald D. Goldblatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE AND STRUCTURE FOR PHOTOVOLTAICS INCLUDING METAL-RICH SI...
- Publication number 20150325716
- Publication date Nov 12, 2015
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...
- Publication number 20150280022
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE, LOW REFLECTION, AND LOW COST CONTACT GRIDS FOR PHOT...
- Publication number 20120285527
- Publication date Nov 15, 2012
- International Business Machines Corporation
- Ronald Goldblatt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR PATTERNING MAGNETIC FILMS
- Publication number 20110272287
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Elizabeth A. Duch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL METHOD TO MAKE HIGH QUALITY DOPED CRYSTALLINE COMPO...
- Publication number 20090283865
- Publication date Nov 19, 2009
- International Business Machines Corporation
- Xiaoyan Shao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE SELECT SYSTEM FOR MULTI-DEVICE ELECTRONIC SYSTEM
- Publication number 20080252357
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Robert Glenn Biskeborn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION
- Publication number 20080073790
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel integration of wire bond pad with Ni/Au metallization
- Publication number 20050074959
- Publication date Apr 7, 2005
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-functional structure for enhanced chip manufacturibility & re...
- Publication number 20040129938
- Publication date Jul 8, 2004
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common ball-limiting metallurgy for I/O sites
- Publication number 20030092254
- Publication date May 15, 2003
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common ball-limiting metallurgy for I/O sites
- Publication number 20020111010
- Publication date Aug 15, 2002
- International Business Machines Corporation
- George F. Walker
- H01 - BASIC ELECTRIC ELEMENTS

Ronald D. Goldblatt

Person

Patents Grantslast 30 patents

Method for fabricating a photovoltaic device by uniform plating on...

Method for fabricating a photovoltaic device by uniform plating on...

Low resistance, low reflection, and low cost contact grids for phot...

Low resistance, low reflection, and low cost contact grids for phot...

Device select system for multi-device electronic system

Method of fabricating a wire bond pad with Ni/Au metallization

Multi-functional structure for enhanced chip manufacturibility and...

Common ball-limiting metallurgy for I/O sites

Copper seed layer repair technique using electroless touch-up

Method of annealing copper metallurgy

Method/structure for creating aluminum wirebound pad on copper BEOL

Method/structure for creating aluminum wirebound pad on copper BEOL

Reactive surface functionalization

Process for producing a metal organic polymer combination

Lamination method for coating the sidewall or filling a cavity in a...

Means of seeding and metallizing polymide

Method for enhancing the adhesion of polymer surfaces by water vapo...

Patents Applicationslast 30 patents

SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...

LOW RESISTANCE, LOW REFLECTION, AND LOW COST CONTACT GRIDS FOR PHOT...

MANUFACTURE AND STRUCTURE FOR PHOTOVOLTAICS INCLUDING METAL-RICH SI...

SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...

LOW RESISTANCE, LOW REFLECTION, AND LOW COST CONTACT GRIDS FOR PHOT...

METHOD FOR PATTERNING MAGNETIC FILMS

ELECTROCHEMICAL METHOD TO MAKE HIGH QUALITY DOPED CRYSTALLINE COMPO...

DEVICE SELECT SYSTEM FOR MULTI-DEVICE ELECTRONIC SYSTEM

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Novel integration of wire bond pad with Ni/Au metallization

Multi-functional structure for enhanced chip manufacturibility & re...

Common ball-limiting metallurgy for I/O sites

Common ball-limiting metallurgy for I/O sites