Ronald D. Myer

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Kokomo, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for integrated circuit packaging
- Patent number 6,472,251
- Issue date Oct 29, 2002
- Delphi Technologies, Inc.
- Ronald D. Myer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wire bonding an aluminum wire to a lead of an electronic...
- Patent number 5,492,263
- Issue date Feb 20, 1996
- Delco Electronics Corp.
- Mark E. Webster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR MIXING A SUBSTANCE WITHIN A CONTAINER
- Publication number 20170173545
- Publication date Jun 22, 2017
- Ronald D. Myer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method for integrated circuit packaging
- Publication number 20020145181
- Publication date Oct 10, 2002
- Delphi Technologies, Inc.
- Ronald D. Myer
- H01 - BASIC ELECTRIC ELEMENTS