Ronald E. Thomas

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Flexible substrate for packaging a semiconductor component
- Patent number 6,300,679
- Issue date Oct 9, 2001
- Semiconductor Components Industries, LLC
- Prosanto K. Mukerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 6,093,583
- Issue date Jul 25, 2000
- Semiconductor Components Industries, LLC
- Prosanto K. Mukerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having rounded or tapered edges and corners
- Patent number 5,119,171
- Issue date Jun 2, 1992
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner design having topological configurations
- Patent number 4,928,162
- Issue date May 22, 1990
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flagless semiconductor package
- Patent number 4,924,291
- Issue date May 8, 1990
- Motorola Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die for plastic encapsulation having an adhesion prom...
- Patent number 4,832,996
- Issue date May 23, 1989
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS