Ronald G. Filippi

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC structure with interdigitated conductive elements between metal...
- Patent number 10,770,407
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel test structure
- Patent number 10,475,677
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Inc.
- Tian Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored C4 pad and method of forming same
- Patent number 10,388,617
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer rigidity with reinforcement structure
- Patent number 10,325,862
- Issue date Jun 18, 2019
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for a security application
- Patent number 10,297,546
- Issue date May 21, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 10,256,186
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 10,229,875
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gap
- Patent number 10,224,236
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch interconnects
- Patent number 10,177,031
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting a void between a via and a wiring line
- Patent number 10,103,068
- Issue date Oct 16, 2018
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,893,011
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having substractive etch feature and damasce...
- Patent number 9,852,980
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect reliability structures
- Patent number 9,817,063
- Issue date Nov 14, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with variable dopant levels
- Patent number 9,768,065
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer rigidity with reinforcement structure
- Patent number 9,761,539
- Issue date Sep 12, 2017
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV deep trench capacitor and anti-fuse structure
- Patent number 9,741,657
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,685,404
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with enhanced reliability
- Patent number 9,673,089
- Issue date Jun 6, 2017
- AURIGA INNOVATIONS, INC
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 9,601,426
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance refractory metal / copper interconnects to elimina...
- Patent number 9,536,830
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with air gap crack stop
- Patent number 9,536,842
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,536,779
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for determining TDDB reliability at reduced...
- Patent number 9,524,916
- Issue date Dec 20, 2016
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect scaling method including forming dielectric layer over...
- Patent number 9,502,350
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored backside C4 pad
- Patent number 9,478,509
- Issue date Oct 25, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,455,186
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,443,776
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,431,293
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-metal E-fuse
- Patent number 9,431,346
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alternate dual damascene method for forming interconnects
- Patent number 9,431,292
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...
- Publication number 20200219826
- Publication date Jul 9, 2020
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ANCHORED C4 PAD AND METHOD OF FORMING SAME
- Publication number 20190123005
- Publication date Apr 25, 2019
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL TEST STRUCTURE
- Publication number 20190067056
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Tian Shen
- G01 - MEASURING TESTING
Information Patent Application
TDDB PERCOLATION CURRENT INDUCED E-FUSE STRUCTURE AND METHOD OF PRO...
- Publication number 20190066812
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Kong Boon Yeap
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION
- Publication number 20190027433
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20180076082
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SCALING
- Publication number 20180076133
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE
- Publication number 20180019214
- Publication date Jan 18, 2018
- GLOBALFOUNDRIES INC.
- Ronald G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20170365504
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT RELIABILITY STRUCTURES
- Publication number 20170242067
- Publication date Aug 24, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT SCALING
- Publication number 20170221815
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE
- Publication number 20160379934
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Ronald G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING A VOID BETWEEN A VIA AND A WIRING LINE
- Publication number 20160370421
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Application
STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20160197039
- Publication date Jul 7, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS AIR GAP CRACK STOP
- Publication number 20160181208
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE ETCH INTERCONNECTS
- Publication number 20160181200
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END ELECTRICALLY PROGRAMMABLE FUSE
- Publication number 20160027733
- Publication date Jan 28, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20150262899
- Publication date Sep 17, 2015
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255343
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255398
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ANCHORED BACKSIDE C4 PAD
- Publication number 20150255410
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255328
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255342
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255387
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20150235946
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV DEEP TRENCH CAPACITOR AND ANTI-FUSE STRUCTURE
- Publication number 20150235944
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE WITH RESISTIVE HEATER
- Publication number 20150228578
- Publication date Aug 13, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY
- Publication number 20150137312
- Publication date May 21, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE AND METAL INTERCONNECTS WITH REDUCED CONTACT RESISTANCE
- Publication number 20150137377
- Publication date May 21, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FUSE WITH LOW DIELECTRIC CONSTANT
- Publication number 20150130018
- Publication date May 14, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS

Ronald G. Filippi

Person

Patents Grantslast 30 patents

IC structure with interdigitated conductive elements between metal...

Parallel test structure

Mechanically anchored C4 pad and method of forming same

Wafer rigidity with reinforcement structure

Interconnect structures for a security application

Interconnect structure having subtractive etch feature and damascen...

Stacked via structure for metal fuse applications

Forming air gap

Subtractive etch interconnects

Detecting a void between a via and a wiring line

Back-end electrically programmable fuse

Interconnect structure having substractive etch feature and damasce...

Interconnect reliability structures

Interconnect structures with variable dopant levels

Wafer rigidity with reinforcement structure

TSV deep trench capacitor and anti-fuse structure

Back-end electrically programmable fuse

Interconnect structure with enhanced reliability

Interconnect structure having subtractive etch feature and damascen...

High performance refractory metal / copper interconnects to elimina...

Structure with air gap crack stop

Selective local metal cap layer formation for improved electromigra...

Structures and methods for determining TDDB reliability at reduced...

Interconnect scaling method including forming dielectric layer over...

Mechanically anchored backside C4 pad

Selective local metal cap layer formation for improved electromigra...

Method and structure for determining thermal cycle reliability

Selective local metal cap layer formation for improved electromigra...

Graphene-metal E-fuse

Alternate dual damascene method for forming interconnects

Patents Applicationslast 30 patents

IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...

MECHANICALLY ANCHORED C4 PAD AND METHOD OF FORMING SAME

PARALLEL TEST STRUCTURE

TDDB PERCOLATION CURRENT INDUCED E-FUSE STRUCTURE AND METHOD OF PRO...

INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION

FORMING AIR GAP

INTERCONNECT SCALING

WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE

FORMING AIR GAP

INTERCONNECT RELIABILITY STRUCTURES

INTERCONNECT SCALING

WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE

DETECTING A VOID BETWEEN A VIA AND A WIRING LINE

STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS

DISCONTINUOUS AIR GAP CRACK STOP

SUBTRACTIVE ETCH INTERCONNECTS

BACK-END ELECTRICALLY PROGRAMMABLE FUSE

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

MECHANICALLY ANCHORED BACKSIDE C4 PAD

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS

TSV DEEP TRENCH CAPACITOR AND ANTI-FUSE STRUCTURE

ELECTRONIC FUSE WITH RESISTIVE HEATER

METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY

GRAPHENE AND METAL INTERCONNECTS WITH REDUCED CONTACT RESISTANCE

VIA-FUSE WITH LOW DIELECTRIC CONSTANT