Ronald Iwata

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Ooita City, JP

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Patents Applicationslast 30 patents

Information Patent Application
Package substrate and its solder pad
- Publication number 20080272489
- Publication date Nov 6, 2008
- Powertech Technology Inc.
- Li-chih Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid array package structure
- Publication number 20070246814
- Publication date Oct 25, 2007
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS