Ronald J. Schutz

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Aluminum metallization doped with iron and copper to prevent electr...
- Patent number 5,243,221
- Issue date Sep 7, 1993
- AT&T Bell Laboratories
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method in vertical integration
- Patent number 5,166,091
- Issue date Nov 24, 1992
- AT&T Bell Laboratories
- Nadia Lifshitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating integrated circuits having shallow junctions
- Patent number 5,149,672
- Issue date Sep 22, 1992
- Nadia Lifshitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reliability testing integrated circuit metal films
- Patent number 5,057,441
- Issue date Oct 15, 1991
- AT&T Bell Laboratories
- Gregory M. Gutt
- G01 - MEASURING TESTING
Information Patent Grant
Process for fabricating integrated circuits having shallow junctions
- Patent number 5,008,217
- Issue date Apr 16, 1991
- AT&T Bell Laboratories
- Christopher J. Case
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of devices utilizing a wet etchback procedure
- Patent number 4,988,405
- Issue date Jan 29, 1991
- AT&T Bell Laboratories
- Edward P. Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum metallization for semiconductor devices
- Patent number 4,975,389
- Issue date Dec 4, 1990
- AT&T Bell Laboratories
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching process
- Patent number 4,871,420
- Issue date Oct 3, 1989
- American Telephone and Telegraph Company, AT&T Bell Laboratories
- Frank B. Alexander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching procedure
- Patent number 4,784,719
- Issue date Nov 15, 1988
- American Telephone and Telegraph Company, AT&T Bell Laboratories
- Ronald J. Schutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interferometric methods and apparatus for device fabrication
- Patent number 4,680,084
- Issue date Jul 14, 1987
- American Telephone and Telegraph Company, AT&T Bell Laboratories
- Peter A. Heimann
- G01 - MEASURING TESTING

Ronald J. Schutz

Person

Patents Grantslast 30 patents

Aluminum metallization doped with iron and copper to prevent electr...

Fabrication method in vertical integration

Process for fabricating integrated circuits having shallow junctions

Method for reliability testing integrated circuit metal films

Process for fabricating integrated circuits having shallow junctions

Fabrication of devices utilizing a wet etchback procedure

Aluminum metallization for semiconductor devices

Selective etching process

Dry etching procedure

Interferometric methods and apparatus for device fabrication