Ronald L. Apreitzer

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Phoenix, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE...
- Publication number 20080023820
- Publication date Jan 31, 2008
- Intel Corporation
- Brian Taggart
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...