Ronald L. Hering

Person

Pleasant Valley, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board cam-action standoff connector
- Patent number 7,394,666
- Issue date Jul 1, 2008
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexure plate for maintaining contact between a cooling plate/heat...
- Patent number 7,239,516
- Issue date Jul 3, 2007
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expandable standoff connector with slit collar and related method
- Patent number 7,086,896
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing a bonded lid from a substrate
- Patent number 6,444,082
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Barrie C. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for improved module assembly using shape memo...
- Patent number 6,436,223
- Issue date Aug 20, 2002
- International Business Machines Corporation
- David L. Edwards
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for assembling a multi-layered ceramic package
- Patent number 6,332,946
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Michael Emmett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for multi-layered ceramic package assembly
- Patent number 6,112,795
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Michael Emmett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module adjustment design and process using shims
- Patent number 6,049,456
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE ASSEMBLY USING CHIP HEAT TO CURE AND VERIFY
- Publication number 20090098666
- Publication date Apr 16, 2009
- International Business Machines Corporation
- Ronald L. Hering
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR
- Publication number 20080232072
- Publication date Sep 25, 2008
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANDABLE STANDOFF CONNECTOR WITH SLIT COLLAR AND RELATED METHOD
- Publication number 20060094296
- Publication date May 4, 2006
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR
- Publication number 20060090927
- Publication date May 4, 2006
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexure plate for maintaining contact between a cooling plate/heat...
- Publication number 20060056156
- Publication date Mar 16, 2006
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Ronald L. Hering

Person

Patents Grantslast 30 patents

Circuit board cam-action standoff connector

Flexure plate for maintaining contact between a cooling plate/heat...

Expandable standoff connector with slit collar and related method

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

Apparatus and method for removing a bonded lid from a substrate

Process and apparatus for improved module assembly using shape memo...

Method for assembling a multi-layered ceramic package

Fixture for multi-layered ceramic package assembly

Electronic module adjustment design and process using shims

Patents Applicationslast 30 patents

CHIP PACKAGE ASSEMBLY USING CHIP HEAT TO CURE AND VERIFY

CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR

EXPANDABLE STANDOFF CONNECTOR WITH SLIT COLLAR AND RELATED METHOD

CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR

Flexure plate for maintaining contact between a cooling plate/heat...

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...