Ronald L. Mendelson

Person

Richmond, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Production of integrated circuit chip packages prohibiting formatio...
- Patent number 7,915,732
- Issue date Mar 29, 2011
- International Business Mahines Corporation
- Stephen P. Ayotte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer thickness control during backside grind
- Patent number 7,134,933
- Issue date Nov 14, 2006
- International Business Machines Corporation
- Donald W. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
- Patent number 6,915,795
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer thickness control during backside grind
- Patent number 6,887,126
- Issue date May 3, 2005
- International Business Machines Corporation
- Donald W. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pad structure
- Patent number 6,806,578
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond passivation pad connection using heated capillary
- Patent number 6,605,526
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Wayne John Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and package including a chip having chamfer...
- Patent number 6,600,213
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer thickness control during backside grind
- Patent number 6,368,881
- Issue date Apr 9, 2002
- International Business Machines Corporation
- Donald W. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
- Patent number 6,271,102
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Donald W. Brouillette
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Mechanical strength die sorting
- Patent number 6,222,145
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Robert F. Cook
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
- Patent number 6,171,873
- Issue date Jan 9, 2001
- International Business Machines Corporation
- Ronald Lee Mendelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting wafer frame at back side grinding (BSG) tool
- Patent number 6,153,536
- Issue date Nov 28, 2000
- International Business Machines Corporation
- Donald W. Brouillette
- B24 - GRINDING POLISHING
Information Patent Grant
Chip crack stop
- Patent number 6,022,791
- Issue date Feb 8, 2000
- International Business Machines Corporation
- Robert Francis Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-layer test pads and methods therefor
- Patent number 5,981,302
- Issue date Nov 9, 1999
- Siemens Aktiengesellschaft
- Frank Alswede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-layer test pads
- Patent number 5,917,197
- Issue date Jun 29, 1999
- Siemens Aktiengesellschaft
- Frank Alswede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
- Patent number 5,888,838
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Ronald Lee Mendelson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION OF INTEGRATED CIRCUIT CHIP PACKAGES PROHIBITING FORMATIO...
- Publication number 20090321914
- Publication date Dec 31, 2009
- International Business Machines Corporation
- Stephen P. Ayotte
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer thickness control during backside grind
- Publication number 20050158889
- Publication date Jul 21, 2005
- Donald W. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for dicing wafers, and semiconductor structures i...
- Publication number 20030211707
- Publication date Nov 13, 2003
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper pad structure
- Publication number 20020056910
- Publication date May 16, 2002
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer thickness control during backside grind
- Publication number 20020048901
- Publication date Apr 25, 2002
- Donald W. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper pad structure
- Publication number 20010052644
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for dicing wafers, and semiconductor structures i...
- Publication number 20010023979
- Publication date Sep 27, 2001
- Donald W. Brouvillette
- B28 - WORKING CEMENT, CLAY, OR STONE

Ronald L. Mendelson

Person

Patents Grantslast 30 patents

Production of integrated circuit chip packages prohibiting formatio...

Wafer thickness control during backside grind

Method and system for dicing wafers, and semiconductor structures i...

Wafer thickness control during backside grind

Copper pad structure

Wirebond passivation pad connection using heated capillary

Semiconductor structure and package including a chip having chamfer...

Wafer thickness control during backside grind

Method and system for dicing wafers, and semiconductor structures i...

Mechanical strength die sorting

Method and apparatus for preventing chip breakage during semiconduc...

Method for mounting wafer frame at back side grinding (BSG) tool

Chip crack stop

Integrated multi-layer test pads and methods therefor

Integrated multi-layer test pads

Method and apparatus for preventing chip breakage during semiconduc...

Patents Applicationslast 30 patents

PRODUCTION OF INTEGRATED CIRCUIT CHIP PACKAGES PROHIBITING FORMATIO...

Wafer thickness control during backside grind

Method and system for dicing wafers, and semiconductor structures i...

Copper pad structure

Wafer thickness control during backside grind

Copper pad structure

Method and system for dicing wafers, and semiconductor structures i...