Ronald Takaoiwata

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Hukou Shiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip stacked package and its mother chip to save interposer
- Patent number 8,304,917
- Issue date Nov 6, 2012
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER
- Publication number 20110133324
- Publication date Jun 9, 2011
- Powertech Technology Inc.
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS