Ronald W. Gedney

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Endicott, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
IC chip attachment
- Patent number 5,483,421
- Issue date Jan 9, 1996
- International Business Machines Corporation
- Ronald W. Gedney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Free form packaging of specific functions within a computer system
- Patent number 5,198,965
- Issue date Mar 30, 1993
- International Business Machines Corporation
- Stephen A. Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallized ceramic and printed circuit module
- Patent number 4,082,394
- Issue date Apr 4, 1978
- International Business Machines Corporation
- Ronald Walker Gedney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 4,072,816
- Issue date Feb 7, 1978
- International Business Machines Corporation
- Ronald W. Gedney
- H01 - BASIC ELECTRIC ELEMENTS