Rong-Chang Feng

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure of an integrated circuit and manufacturing m...
- Patent number 8,026,603
- Issue date Sep 27, 2011
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,754,599
- Issue date Jul 13, 2010
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,545,039
- Issue date Jun 9, 2009
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-electrical module packaging
- Patent number 7,004,642
- Issue date Feb 28, 2006
- Industrial Technology Research Institute
- Wen-Yan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20090156001
- Publication date Jun 18, 2009
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure of an integrated circuit and manufacturing m...
- Publication number 20070128845
- Publication date Jun 7, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20070108572
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opto-electrical module packaging
- Publication number 20030161367
- Publication date Aug 28, 2003
- Wen-Yan Chen
- H01 - BASIC ELECTRIC ELEMENTS