Rong ZHOU

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits (ICs) with multi-row columnar die interconnects...
- Patent number 11,791,272
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Rong Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES
- Publication number 20220320026
- Publication date Oct 6, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS...
- Publication number 20220285280
- Publication date Sep 8, 2022
- QUALCOMM Incorporated
- Rong ZHOU
- H01 - BASIC ELECTRIC ELEMENTS