Rongwang DAI

Person

Shanghai, CN

People

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387171
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL GROWING METHOD, APPARATUS AND RF-SOI SUBSTRATE
- Publication number 20240218564
- Publication date Jul 4, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR PREPARING SILICON-ON-INSULATOR
- Publication number 20240153764
- Publication date May 9, 2024
- SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY...
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER
- Publication number 20240096645
- Publication date Mar 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND MANUFACTURE THEREOF
- Publication number 20230178366
- Publication date Jun 8, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF SURFACE TREATMENT OF SOI WAFER
- Publication number 20230133916
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT OF SOI WAFER
- Publication number 20230137599
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- C30 - CRYSTAL GROWTH
Information Patent Application
SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...
- Publication number 20230133092
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME
- Publication number 20230134308
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS

Rongwang DAI

Person

Patents Applicationslast 30 patents

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

CRYSTAL GROWING METHOD, APPARATUS AND RF-SOI SUBSTRATE

METHOD FOR PREPARING SILICON-ON-INSULATOR

SOI WAFER

SEMICONDUCTOR SUBSTRATE AND MANUFACTURE THEREOF

PROCESS OF SURFACE TREATMENT OF SOI WAFER

SURFACE TREATMENT OF SOI WAFER

SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...

SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME