Ronnie M. DE VILLA

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,661
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230377896
- Publication date Nov 23, 2023
- UTAC Headquarters Pte. Ltd.
- Jackson Fernandez Rosario
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230274979
- Publication date Aug 31, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230178413
- Publication date Jun 8, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd SHARIFF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING
- Publication number 20230154795
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230154796
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210118738
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Enrique Jr SARILE
- H01 - BASIC ELECTRIC ELEMENTS

Ronnie M. DE VILLA

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Patents Applicationslast 30 patents

BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF

Semiconductor Packages and Methods of Forming RDL and Side and Back...

PLASMA DICED WAFERS AND METHODS THEREOF

PLASMA DICED WAFERS AND METHODS THEREOF

FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING

PLASMA DICED WAFERS AND METHODS THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES