Ronny Kern

Person

Finkenstein, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device having frame structu...
- Patent number 11,990,520
- Issue date May 21, 2024
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 11,715,768
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,211,459
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 11,069,778
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact connection on silicon carbide substrate
- Patent number 11,043,383
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier, method for manufacturing the same and method for car...
- Patent number 10,763,151
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor device having a Schottky c...
- Patent number 10,763,339
- Issue date Sep 1, 2020
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate carrier, a processing arrangement and a method
- Patent number 10,699,934
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction structure in a power semiconductor device
- Patent number 10,615,040
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with non-ohmic contact between SiC and a conta...
- Patent number 10,431,698
- Issue date Oct 1, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device having a non-ohmic...
- Patent number 10,199,514
- Issue date Feb 5, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier, method for manufacturing the same and method for car...
- Patent number 9,917,000
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor regions including impurities
- Patent number 9,029,250
- Issue date May 12, 2015
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Components and Methods for Producing Silicon Carbid...
- Publication number 20230334337
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
- Publication number 20230317666
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...
- Publication number 20220085174
- Publication date Mar 17, 2022
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing an Electrical Contact on a Silicon Carbide Su...
- Publication number 20210265168
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20200194558
- Publication date Jun 18, 2020
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Connection on Silicon Carbide Substrate
- Publication number 20190362973
- Publication date Nov 28, 2019
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...
- Publication number 20190140111
- Publication date May 9, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Components and Methods for Producing Silicon Carbid...
- Publication number 20190067425
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Carrier, Method for Manufacturing the Same and Method for Car...
- Publication number 20180197766
- Publication date Jul 12, 2018
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...
- Publication number 20180158964
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Method for Forming Semiconductor Devices
- Publication number 20180068975
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Structure in a Power Semiconductor Device
- Publication number 20170358452
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Carrier, Method for Manufacturing the Same and Method for Car...
- Publication number 20170098569
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER, A PROCESSING ARRANGEMENT AND A METHOD
- Publication number 20170098570
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device Having a Schottky C...
- Publication number 20160276452
- Publication date Sep 22, 2016
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Surface
- Publication number 20160211140
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor D...
- Publication number 20160181441
- Publication date Jun 23, 2016
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Semiconductor Regions Including Impurities
- Publication number 20150087129
- Publication date Mar 26, 2015
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device having frame structu...

Process for producing an electrical contact on a silicon carbide su...

Silicon carbide components and methods for producing silicon carbid...

Semiconductor package devices and method for forming semiconductor...

Semiconductor device and method of manufacturing a semiconductor de...

Silicon carbide components and methods for producing silicon carbid...

Electrical contact connection on silicon carbide substrate

Wafer carrier, method for manufacturing the same and method for car...

Method for manufacturing a semiconductor device having a Schottky c...

Substrate carrier, a processing arrangement and a method

Superjunction structure in a power semiconductor device

Semiconductor device with non-ohmic contact between SiC and a conta...

Methods for manufacturing a semiconductor device having a non-ohmic...

Wafer carrier, method for manufacturing the same and method for car...

Method for producing semiconductor regions including impurities

Patents Applicationslast 30 patents

Chip with a Silicon Carbide Substrate

Silicon Carbide Components and Methods for Producing Silicon Carbid...

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...

Process for Producing an Electrical Contact on a Silicon Carbide Su...

Semiconductor Device and Method of Manufacturing a Semiconductor De...

Electrical Contact Connection on Silicon Carbide Substrate

Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...

Silicon Carbide Components and Methods for Producing Silicon Carbid...

Wafer Carrier, Method for Manufacturing the Same and Method for Car...

Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...

Semiconductor Devices and Method for Forming Semiconductor Devices

Superjunction Structure in a Power Semiconductor Device

Wafer Carrier, Method for Manufacturing the Same and Method for Car...

SUBSTRATE CARRIER, A PROCESSING ARRANGEMENT AND A METHOD

Method for Manufacturing a Semiconductor Device Having a Schottky C...

Method for Processing a Semiconductor Surface

Semiconductor Device and Method for Manufacturing a Semiconductor D...

Method for Producing Semiconductor Regions Including Impurities