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Rosa Lynda Nuno
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Canton, MI, US
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last 30 patents
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Patent Grant
Solderless flip-chip assembly and method and material for same
Patent number
6,326,241
Issue date
Dec 4, 2001
Visteon Global Technologies, Inc.
Robert Edward Belke
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for ultrasonic bonding flexible circuits
Patent number
6,019,271
Issue date
Feb 1, 2000
Ford Motor Company
Brian John Hayden
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR