Rosalinda M Ring

Person

Leominster, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Resistivity analysis
- Patent number 7,062,399
- Issue date Jun 13, 2006
- Advance Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Selective etch for uniform metal trace exposure and milling using f...
- Patent number 7,029,595
- Issue date Apr 18, 2006
- Advanced Micro Devices, Inc.
- Xia (Susan) Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical analysis of integrated circuits
- Patent number 7,019,511
- Issue date Mar 28, 2006
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Indirect stimulation of an integrated circuit die
- Patent number 6,870,379
- Issue date Mar 22, 2005
- Advanced Micro Devices, Inc.
- Brennan V. Davis
- G01 - MEASURING TESTING
Information Patent Grant
IC die analysis via back side lens
- Patent number 6,864,972
- Issue date Mar 8, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die analysis via fiber optic communication
- Patent number 6,850,081
- Issue date Feb 1, 2005
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Fiber optic semiconductor analysis arrangement and method therefor
- Patent number 6,844,928
- Issue date Jan 18, 2005
- Advanced Micro Devices, Inc.
- Glen P. Gilfeather
- G01 - MEASURING TESTING
Information Patent Grant
Substrate removal as a function of emitted photons at the back side...
- Patent number 6,806,166
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-assisted etch with oxygen
- Patent number 6,806,198
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure having backside probe points for direct sig...
- Patent number 6,720,641
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Jeffrey David Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor analysis arrangement and method therefor
- Patent number 6,700,659
- Issue date Mar 2, 2004
- Advanced Micro Devices, Inc.
- Srikar V. Chunduri
- G01 - MEASURING TESTING
Information Patent Grant
Defect detection in semiconductor devices
- Patent number 6,686,757
- Issue date Feb 3, 2004
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor analysis arrangement and method therefor
- Patent number 6,635,839
- Issue date Oct 21, 2003
- Advanced Micro Devices, Inc.
- Glen P. Gilfeather
- G01 - MEASURING TESTING
Information Patent Grant
Method of substrate silicon removal for integrated circuit devices
- Patent number 6,635,572
- Issue date Oct 21, 2003
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI die analysis of circuitry logic states via coupling through the...
- Patent number 6,621,281
- Issue date Sep 16, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
IC die analysis via back side circuit construction with heat dissip...
- Patent number 6,576,484
- Issue date Jun 10, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate removal as a function of sputtered ions
- Patent number 6,565,720
- Issue date May 20, 2003
- Advanced Micro Devices, Inc.
- Rosalinda M. Ring
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for analyzing functional failures in integrate...
- Patent number 6,549,022
- Issue date Apr 15, 2003
- Sandia Corporation
- Edward I. Cole
- G01 - MEASURING TESTING
Information Patent Grant
Data processing device test apparatus and method therefor
- Patent number 6,546,513
- Issue date Apr 8, 2003
- Advanced Micro Devices
- Richard Jacob Wilcox
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic resonance imaging of semiconductor devices
- Patent number 6,529,029
- Issue date Mar 4, 2003
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Circuit construction in back side of die and over a buried insulator
- Patent number 6,518,783
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Test fixture for future integration
- Patent number 6,500,699
- Issue date Dec 31, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Quadrant avalanche photodiode time-resolved detection
- Patent number 6,483,327
- Issue date Nov 19, 2002
- Advanced Micro Devices, Inc.
- Michael R. Bruce
- G01 - MEASURING TESTING
Information Patent Grant
Nanomachining of integrated circuits
- Patent number 6,472,760
- Issue date Oct 29, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe grid for integrated circuit analysis
- Patent number 6,455,334
- Issue date Sep 24, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING
Information Patent Grant
Atomic force microscopy and signal acquisition via buried insulator
- Patent number 6,448,096
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit access and analysis for a SOI flip-chip die
- Patent number 6,448,095
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Intergrated circuit integrity analysis as a function of magnetic fi...
- Patent number 6,433,572
- Issue date Aug 13, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING
Information Patent Grant
Acoustic 3D analysis of circuit structures
- Patent number 6,430,728
- Issue date Aug 6, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Defect detection via acoustic analysis
- Patent number 6,421,811
- Issue date Jul 16, 2002
- Advanced Micro Devices, Inc.
- Rama R. Goruganthu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOI die analysis of circuitry logic states via coupling through the...
- Publication number 20020084792
- Publication date Jul 4, 2002
- Advanced Micro Devices, Inc.
- Jeffrey D. Birdsley
- G01 - MEASURING TESTING

Rosalinda M Ring

Person

Patents Grantslast 30 patents

Resistivity analysis

Selective etch for uniform metal trace exposure and milling using f...

Optical analysis of integrated circuits

Indirect stimulation of an integrated circuit die

IC die analysis via back side lens

Semiconductor die analysis via fiber optic communication

Fiber optic semiconductor analysis arrangement and method therefor

Substrate removal as a function of emitted photons at the back side...

Gas-assisted etch with oxygen

Semiconductor structure having backside probe points for direct sig...

Semiconductor analysis arrangement and method therefor

Defect detection in semiconductor devices

Semiconductor analysis arrangement and method therefor

Method of substrate silicon removal for integrated circuit devices

SOI die analysis of circuitry logic states via coupling through the...

IC die analysis via back side circuit construction with heat dissip...

Substrate removal as a function of sputtered ions

Apparatus and method for analyzing functional failures in integrate...

Data processing device test apparatus and method therefor

Magnetic resonance imaging of semiconductor devices

Circuit construction in back side of die and over a buried insulator

Test fixture for future integration

Quadrant avalanche photodiode time-resolved detection

Nanomachining of integrated circuits

Probe grid for integrated circuit analysis

Atomic force microscopy and signal acquisition via buried insulator

Circuit access and analysis for a SOI flip-chip die

Intergrated circuit integrity analysis as a function of magnetic fi...

Acoustic 3D analysis of circuit structures

Defect detection via acoustic analysis

Patents Applicationslast 30 patents

SOI die analysis of circuitry logic states via coupling through the...