Roseann Alatorre

Person

San Martin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffened wires for offset BVA
- Patent number 9,659,848
- Issue date May 23, 2017
- Invensas Corporation
- Grant Villavicencio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a component having wire bonds and a stiffening layer
- Patent number 9,601,454
- Issue date Mar 21, 2017
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package having wire bond vias and stiffening layer
- Patent number 9,136,254
- Issue date Sep 15, 2015
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,105,483
- Issue date Aug 11, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,041,227
- Issue date May 26, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,836,136
- Issue date Sep 16, 2014
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,404,520
- Issue date Mar 26, 2013
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENED WIRES FOR OFFSET BVA
- Publication number 20170141020
- Publication date May 18, 2017
- Invensas Corporation
- Grant Villavicencio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER
- Publication number 20150380375
- Publication date Dec 31, 2015
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20150255424
- Publication date Sep 10, 2015
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER
- Publication number 20140217619
- Publication date Aug 7, 2014
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130095610
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093087
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093088
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

Roseann Alatorre

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Stiffened wires for offset BVA

Method of forming a component having wire bonds and a stiffening layer

Package-on-package assembly with wire bond vias

Microelectronic package having wire bond vias and stiffening layer

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Package-on-package Assembly With Wire Bond Vias

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

STIFFENED WIRES FOR OFFSET BVA

MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS