Roslie Saini bin Bakar

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Dual step laser processing of an encapsulant of a semiconductor chi...
- Patent number 11,791,169
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD INCLUDING ENCAPSULATING SPACED CHIPS BY LOC...
- Publication number 20240186152
- Publication date Jun 6, 2024
- INFINEON TECHNOLOGIES AG
- Roslie Saini BAKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chi...
- Publication number 20210050227
- Publication date Feb 18, 2021
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS