Roupen Keusseyan

Person

Carlsbad, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Electro-conductive paste comprising Ag nano-particles and spherical...
- Patent number 10,403,769
- Issue date Sep 3, 2019
- Heraeus Deutschland GmbH & Co. KG
- Christian Muschelknautz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,374,892
- Issue date Jun 21, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,337,060
- Issue date May 10, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,236,274
- Issue date Jan 12, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for metallization and reinforcement of glass subs...
- Patent number 9,184,135
- Issue date Nov 10, 2015
- TRINTON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for metallization and reinforcement of glass subs...
- Patent number 9,184,064
- Issue date Nov 10, 2015
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190322572
- Publication date Oct 24, 2019
- Samtec Inc.
- Tim MOBLEY
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190326130
- Publication date Oct 24, 2019
- Samtec Inc.
- Tim MOBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190304877
- Publication date Oct 3, 2019
- Samtec Inc.
- Tim MOBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-CONDUCTIVE PASTE COMPRISING AG NANO-PARTICLES AND SPHERICAL...
- Publication number 20150263192
- Publication date Sep 17, 2015
- HERAEUS PRECIOUS METALS GMBH & CO. KG
- Christian Muschelknautz
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Roupen Keusseyan

Person

Patents Grantslast 30 patents

Method of fabricating a glass substrate with a plurality of vias

Filling materials and methods of filling through holes of a substrate

Electro-conductive paste comprising Ag nano-particles and spherical...

Filling materials and methods of filling through holes for improved...

Filling materials and methods of filling through holes for improved...

Filling materials and methods of filling through holes for improved...

System and method for metallization and reinforcement of glass subs...

System and method for metallization and reinforcement of glass subs...

Patents Applicationslast 30 patents

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

ELECTRO-CONDUCTIVE PASTE COMPRISING AG NANO-PARTICLES AND SPHERICAL...