Roveendra PAUL

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat transfer for power modules
- Patent number 11,610,832
- Issue date Mar 21, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 10,665,525
- Issue date May 26, 2020
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20250038066
- Publication date Jan 30, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240237216
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...
- Publication number 20240136259
- Publication date Apr 25, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240138069
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...
- Publication number 20240128197
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Olaf ZSCHIESCHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING METHOD FOR DIRECT LIQUID COOLED POWER ELECTRONICS PACKAGE
- Publication number 20240064944
- Publication date Feb 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Roveendra PAUL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20230230895
- Publication date Jul 20, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20230225044
- Publication date Jul 13, 2023
- Semiconductor Components Industries, LLC
- Oseob JEON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200335414
- Publication date Oct 22, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20190341327
- Publication date Nov 7, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS

Roveendra PAUL

Person

Patents Grantslast 30 patents

Heat transfer for power modules

Heat transfer for power modules

Patents Applicationslast 30 patents

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...

SEALING METHOD FOR DIRECT LIQUID COOLED POWER ELECTRONICS PACKAGE

HEAT TRANSFER FOR POWER MODULES

STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

HEAT TRANSFER FOR POWER MODULES

HEAT TRANSFER FOR POWER MODULES