Roxanna Bauzon Samson

Person

Benguet, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for making integrated circuit packages
- Patent number 11,152,324
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip assembly and method of processing
- Patent number 9,698,085
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Rex Araneta Cari-an
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gang clips having distributed-function tie bars
- Patent number 9,355,942
- Issue date May 31, 2016
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making a flip-chip assembly with bond fingers
- Patent number 9,219,052
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with bond fingers
- Patent number 8,766,461
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Raymond Partosa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
- Publication number 20180033758
- Publication date Feb 1, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP ASSEMBLY AND METHOD OF PROCESSING
- Publication number 20170179008
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rex Araneta Cari-an
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
- Publication number 20160276185
- Publication date Sep 22, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Method Using Pre-Applied Attachment Me...
- Publication number 20150371930
- Publication date Dec 24, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG CLIPS HAVING DISTRIBUTED-FUNCTION TIE BARS
- Publication number 20150332989
- Publication date Nov 19, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
- Publication number 20140248746
- Publication date Sep 4, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BOND FINGERS
- Publication number 20140197534
- Publication date Jul 17, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS

Roxanna Bauzon Samson

Person

Patents Grantslast 30 patents

Method and apparatus for making integrated circuit packages

Leadframe strip assembly and method of processing

Gang clips having distributed-function tie bars

Making a flip-chip assembly with bond fingers

Substrate with bond fingers

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES

LEADFRAME STRIP ASSEMBLY AND METHOD OF PROCESSING

METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES

Integrated Circuit Packaging Method Using Pre-Applied Attachment Me...

GANG CLIPS HAVING DISTRIBUTED-FUNCTION TIE BARS

MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS

SUBSTRATE WITH BOND FINGERS