Roy Antoin Bastiaan Engelen

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Geleen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Low warpage wafer bonding through use of slotted substrates
- Patent number 10,084,110
- Issue date Sep 25, 2018
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state light emitting device and method of manufacturing a sol...
- Patent number 9,882,091
- Issue date Jan 30, 2018
- Koninklijke Philips N.V.
- Sander Petrus Martinus Noijen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state light emitting device and method of manufacturing a sol...
- Patent number 9,812,612
- Issue date Nov 7, 2017
- Koninklijke Philips N.V.
- Sander Petrus Martinus Noijen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage wafer bonding through use of slotted substrates
- Patent number 9,583,676
- Issue date Feb 28, 2017
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES
- Publication number 20170200853
- Publication date Jul 13, 2017
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SOLID STATE LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING A S...
- Publication number 20160329467
- Publication date Nov 10, 2016
- Koninklijke Philips N.V.
- Sander Petrus Martinus Noijen
- H01 - BASIC ELECTRIC ELEMENTS