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Roy D. Holloway
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Chandler, AZ, US
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last 30 patents
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Patent Grant
Method of making and stacking a semiconductor package
Patent number
6,564,454
Issue date
May 20, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor package and circuit board for making the package
Patent number
6,448,506
Issue date
Sep 10, 2002
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS