Roy Dittler

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,159,844
- Issue date Dec 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal deposition by patterning direct electroless metal p...
- Patent number 11,501,967
- Issue date Nov 15, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a flexible wearable circuit
- Patent number 10,798,817
- Issue date Oct 6, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220093535
- Publication date Mar 24, 2022
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING PROCESS
- Publication number 20220010452
- Publication date Jan 13, 2022
- Intel Corporation
- Chandrasekharan NAIR
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTIPLE LAYER COPPER SEEDING
- Publication number 20210090946
- Publication date Mar 25, 2021
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING EMBEDDED GROUNDING PLANES ON INTERCONNECT LAYERS
- Publication number 20200328131
- Publication date Oct 15, 2020
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL DEPOSITION BY PATTERNING DIRECT ELECTROLESS METAL P...
- Publication number 20200251332
- Publication date Aug 6, 2020
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
- Publication number 20200245472
- Publication date Jul 30, 2020
- Intel Corporation
- Darko GRUJICIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...
- Publication number 20180376585
- Publication date Dec 27, 2018
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Roy Dittler

Person

Patents Grantslast 30 patents

Electronic substrates having embedded inductors

Method for forming embedded grounding planes on interconnect layers

Selective metal deposition by patterning direct electroless metal p...

Apparatus with a substrate provided with plasma treatment

Method for making a flexible wearable circuit

Patents Applicationslast 30 patents

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

ELECTROLESS PLATING PROCESS

MULTIPLE LAYER COPPER SEEDING

METHOD FOR FORMING EMBEDDED GROUNDING PLANES ON INTERCONNECT LAYERS

SELECTIVE METAL DEPOSITION BY PATTERNING DIRECT ELECTROLESS METAL P...

APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT

MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...