Roy Meade

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Beam steering structure with integrated polarization splitter
- Patent number 12,092,880
- Issue date Sep 17, 2024
- Ayar Labs, Inc.
- John Fini
- G02 - OPTICS
Information Patent Grant
Wafer-level etching methods for planar photonics circuits and devices
- Patent number 12,057,332
- Issue date Aug 6, 2024
- Ayar Labs, Inc.
- Chen Sun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 12,019,269
- Issue date Jun 25, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Systems and methods for wafer-level photonic testing
- Patent number 12,014,962
- Issue date Jun 18, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip optical data communication system
- Patent number 11,994,724
- Issue date May 28, 2024
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Grant
Remote memory architectures enabled by monolithic in-package optica...
- Patent number 11,916,602
- Issue date Feb 27, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical integrated photonics chiplet for in-package optical interc...
- Patent number 11,899,251
- Issue date Feb 13, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic systems to enable top-side wafer-level optical and electri...
- Patent number 11,867,944
- Issue date Jan 9, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Fiber attach enabled wafer level fanout
- Patent number 11,822,128
- Issue date Nov 21, 2023
- Ayar Labs, Inc.
- Shahab Ardalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-last wafer-level fan-out with optical fiber alignment structure
- Patent number 11,823,990
- Issue date Nov 21, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser module for optical data communication system within silicon i...
- Patent number 11,799,554
- Issue date Oct 24, 2023
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multiplexer/demultiplexer module and associated methods
- Patent number 11,777,633
- Issue date Oct 3, 2023
- Ayar Labs, Inc.
- Vladimir Stojanovic
- G02 - OPTICS
Information Patent Grant
Pooled memory system enabled by monolithic in-package optical I/O
- Patent number 11,705,972
- Issue date Jul 18, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems and methods for wafer-level photonic testing
- Patent number 11,694,935
- Issue date Jul 4, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical interface module and associated methods
- Patent number 11,563,506
- Issue date Jan 24, 2023
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods and systems for hermetically sealed fiber to chip connections
- Patent number 11,536,915
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- Roy Meade
- G02 - OPTICS
Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 11,500,153
- Issue date Nov 15, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 11,493,708
- Issue date Nov 8, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser module for optical data communication system
- Patent number 11,424,830
- Issue date Aug 23, 2022
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TORminator system and associated methods
- Patent number 11,405,125
- Issue date Aug 2, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- G02 - OPTICS
Information Patent Grant
Laser module for optical data communication system within silicon i...
- Patent number 11,394,465
- Issue date Jul 19, 2022
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including two-dimensional material structures
- Patent number 11,393,687
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Roy E. Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and optoelectronic structure providing polysilicon photonic...
- Patent number 11,322,629
- Issue date May 3, 2022
- Micron Technology, Inc.
- Roy Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beam steering structure with integrated polarization splitter
- Patent number 11,280,970
- Issue date Mar 22, 2022
- Ayar Labs, Inc.
- John Fini
- G02 - OPTICS
Information Patent Grant
Photonics systems to enable top-side wafer-level optical and electr...
- Patent number 11,280,959
- Issue date Mar 22, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip optical data communication system
- Patent number 11,249,260
- Issue date Feb 15, 2022
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Grant
Method and structure providing optical isolation of a waveguide on...
- Patent number 11,237,327
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Roy E. Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multiplexer/demultiplexer module and associated methods
- Patent number 11,233,596
- Issue date Jan 25, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pooled DRAM system enabled by monolithic in-package optical I/O
- Patent number 11,233,580
- Issue date Jan 25, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods and apparatus providing thermal isolation of photonic devices
- Patent number 11,217,737
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Roy Meade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Beam Steering Structure with Integrated Polarization Splitter
- Publication number 20250012982
- Publication date Jan 9, 2025
- Ayar Labs, Inc.
- John Fini
- G02 - OPTICS
Information Patent Application
Chip-to-Chip Optical Data Communication System
- Publication number 20240310589
- Publication date Sep 19, 2024
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Application
Remote Memory Architectures Enabled by Monolithic In-Package Optica...
- Publication number 20240187110
- Publication date Jun 6, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20240176081
- Publication date May 30, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure
- Publication number 20240170387
- Publication date May 23, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fiber Attach Enabled Wafer Level Fanout
- Publication number 20240061181
- Publication date Feb 22, 2024
- Ayar Labs, Inc.
- Shahab Ardalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Module for Optical Data Communication System within Silicon I...
- Publication number 20240014904
- Publication date Jan 11, 2024
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pooled Memory System Enabled by Monolithic In-Package Optical I/O
- Publication number 20230370170
- Publication date Nov 16, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Application
Systems and Methods for Wafer-Level Photonic Testing
- Publication number 20230343655
- Publication date Oct 26, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G01 - MEASURING TESTING
Information Patent Application
Multi-Chip Packaging of Silicon Photonics
- Publication number 20230070458
- Publication date Mar 9, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Application
Thermal Management System for Multi-Chip-Module and Associated Methods
- Publication number 20230068239
- Publication date Mar 2, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Module for Optical Data Communication System
- Publication number 20220407606
- Publication date Dec 22, 2022
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Module for Optical Data Communication System within Silicon I...
- Publication number 20220360336
- Publication date Nov 10, 2022
- Ayar Labs, Inc.
- Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS INCLUDING TWO-DIMENSIONAL MATERIAL STRUCTURES
- Publication number 20220344160
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Roy E. Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND OPTOELECTRONIC STRUCTURE PROVIDING POLYSILICON PHOTONIC...
- Publication number 20220231178
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Roy Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Multiplexer/Demultiplexer Module and Associated Methods
- Publication number 20220224433
- Publication date Jul 14, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Photonic Systems to Enable Top-Side Wafer-Level Optical and Electri...
- Publication number 20220214497
- Publication date Jul 7, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Beam Steering Structure with Integrated Polarization Splitter
- Publication number 20220214509
- Publication date Jul 7, 2022
- Ayar Labs, Inc.
- John Fini
- G02 - OPTICS
Information Patent Application
Chip-to-Chip Optical Data Communication System
- Publication number 20220171142
- Publication date Jun 2, 2022
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Application
Planar Fiber Shuffle
- Publication number 20220163723
- Publication date May 26, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low-Power Optical Input/Output Chiplet for Ethernet Switches (TeraP...
- Publication number 20220166533
- Publication date May 26, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Pooled Memory System Enabled by Monolithic In-Package Optical I/O
- Publication number 20220148627
- Publication date May 12, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Application
Fiber Attach Enabled Wafer Level Fanout
- Publication number 20220107463
- Publication date Apr 7, 2022
- Ayar Labs, Inc.
- Shahab Ardalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-Optical Interface Module and Associated Methods
- Publication number 20220045780
- Publication date Feb 10, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Pooled DRAM System Enabled by Monolithic In-Package Optical I/O
- Publication number 20210257021
- Publication date Aug 19, 2021
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Application
Remote Memory Architectures Enabled by Monolithic In-Package Optica...
- Publication number 20210258078
- Publication date Aug 19, 2021
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure
- Publication number 20210257288
- Publication date Aug 19, 2021
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR HERMETICALLY SEALED FIBER TO CHIP CONNECTIONS
- Publication number 20210141174
- Publication date May 13, 2021
- Micron Technology, Inc.
- Roy Meade
- G02 - OPTICS
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20210132309
- Publication date May 6, 2021
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND OPTOELECTRONIC STRUCTURE PROVIDING POLYSILICON PHOTONIC...
- Publication number 20210135025
- Publication date May 6, 2021
- Micron Technology, Inc.
- Roy Meade
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Beam steering structure with integrated polarization splitter

Wafer-level etching methods for planar photonics circuits and devices

Multi-chip packaging of silicon photonics

Systems and methods for wafer-level photonic testing

Chip-to-chip optical data communication system

Remote memory architectures enabled by monolithic in-package optica...

Vertical integrated photonics chiplet for in-package optical interc...

Photonic systems to enable top-side wafer-level optical and electri...

Fiber attach enabled wafer level fanout

Chip-last wafer-level fan-out with optical fiber alignment structure

Laser module for optical data communication system within silicon i...

Optical multiplexer/demultiplexer module and associated methods

Pooled memory system enabled by monolithic in-package optical I/O

Systems and methods for wafer-level photonic testing

Electro-optical interface module and associated methods

Methods and systems for hermetically sealed fiber to chip connections

Multi-chip packaging of silicon photonics

Thermal management system for multi-chip-module and associated methods

Laser module for optical data communication system

TORminator system and associated methods

Laser module for optical data communication system within silicon i...

Semiconductor devices including two-dimensional material structures

Method and optoelectronic structure providing polysilicon photonic...

Beam steering structure with integrated polarization splitter

Photonics systems to enable top-side wafer-level optical and electr...

Chip-to-chip optical data communication system

Method and structure providing optical isolation of a waveguide on...

Optical multiplexer/demultiplexer module and associated methods

Pooled DRAM system enabled by monolithic in-package optical I/O

Methods and apparatus providing thermal isolation of photonic devices

Patents Applicationslast 30 patents

Beam Steering Structure with Integrated Polarization Splitter

Chip-to-Chip Optical Data Communication System

Remote Memory Architectures Enabled by Monolithic In-Package Optica...

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure

Fiber Attach Enabled Wafer Level Fanout

Laser Module for Optical Data Communication System within Silicon I...

Pooled Memory System Enabled by Monolithic In-Package Optical I/O

Systems and Methods for Wafer-Level Photonic Testing

Multi-Chip Packaging of Silicon Photonics

Thermal Management System for Multi-Chip-Module and Associated Methods

Laser Module for Optical Data Communication System

Laser Module for Optical Data Communication System within Silicon I...

ELECTRONIC SYSTEMS INCLUDING TWO-DIMENSIONAL MATERIAL STRUCTURES

METHOD AND OPTOELECTRONIC STRUCTURE PROVIDING POLYSILICON PHOTONIC...

Optical Multiplexer/Demultiplexer Module and Associated Methods

Photonic Systems to Enable Top-Side Wafer-Level Optical and Electri...

Beam Steering Structure with Integrated Polarization Splitter

Chip-to-Chip Optical Data Communication System

Planar Fiber Shuffle

Low-Power Optical Input/Output Chiplet for Ethernet Switches (TeraP...

Pooled Memory System Enabled by Monolithic In-Package Optical I/O

Fiber Attach Enabled Wafer Level Fanout

Electro-Optical Interface Module and Associated Methods

Pooled DRAM System Enabled by Monolithic In-Package Optical I/O

Remote Memory Architectures Enabled by Monolithic In-Package Optica...

Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure

METHODS AND SYSTEMS FOR HERMETICALLY SEALED FIBER TO CHIP CONNECTIONS

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

METHOD AND OPTOELECTRONIC STRUCTURE PROVIDING POLYSILICON PHOTONIC...