Ruben B. Montez

Person

Cedar Park, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Rough MEMS surface
- Patent number 9,988,260
- Issue date Jun 5, 2018
- NXP USA, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for selective etching using dry film photoresist
- Patent number 9,960,081
- Issue date May 1, 2018
- NXP USA, INC.
- Colin Bryant Stevens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing MEMS stiction by deposition of nanoclusters
- Patent number 9,776,853
- Issue date Oct 3, 2017
- NXP USA, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Etch release residue removal using anhydrous solution
- Patent number 9,663,356
- Issue date May 30, 2017
- NXP USA, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded wafer structure having cavities with low pressure and method...
- Patent number 9,637,372
- Issue date May 2, 2017
- NXP USA, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by increasing surface roughness
- Patent number 9,550,664
- Issue date Jan 24, 2017
- NXP USA, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by introduction of a carbon barrier
- Patent number 9,463,973
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for anchoring components in MEMS semiconductor...
- Patent number 9,458,010
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a MEMS die having a MEMS device on a suspended str...
- Patent number 9,458,008
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by deposition of nanoclusters
- Patent number 9,434,602
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass frit wafer bond protective structure
- Patent number 9,425,115
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via with diffused conductive component
- Patent number 9,318,376
- Issue date Apr 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Paige M Holm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing MEMS stiction by deposition of nanoclusters
- Patent number 9,290,380
- Issue date Mar 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing microelectromechanical systems stiction by formation of a...
- Patent number 9,108,842
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by introduction of a carbon barrier
- Patent number 8,895,339
- Issue date Nov 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass frit wafer bond protective structure
- Patent number 8,633,088
- Issue date Jan 21, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a micro-electro-mechanical-systems (MEMS) device
- Patent number 8,455,286
- Issue date Jun 4, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing microelectromechanical device with isolated mic...
- Patent number 7,943,525
- Issue date May 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lisa Z. Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ROUGH MEMS SURFACE
- Publication number 20170313573
- Publication date Nov 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED WAFER STRUCTURE HAVING CAVITIES WITH LOW PRESSURE AND METHOD...
- Publication number 20160311676
- Publication date Oct 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. STEIMLE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD FOR SUSPENDED MEMS DEVICE
- Publication number 20160272482
- Publication date Sep 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- CHAD S. DAWSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS FRIT WAFER BOND PROTECTIVE STRUCTURE
- Publication number 20160218045
- Publication date Jul 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- RUBEN B. MONTEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING MEMS STICTION BY INCREASING SURFACE ROUGHNESS
- Publication number 20160176707
- Publication date Jun 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS
- Publication number 20160167944
- Publication date Jun 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS
- Publication number 20160031698
- Publication date Feb 4, 2016
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCH RELEASE RESIDUE REMOVAL USING ANHYDROUS SOLUTION
- Publication number 20150368099
- Publication date Dec 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER
- Publication number 20150054096
- Publication date Feb 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A...
- Publication number 20150021717
- Publication date Jan 22, 2015
- Michael D. Turner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS
- Publication number 20140167189
- Publication date Jun 19, 2014
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER
- Publication number 20140167188
- Publication date Jun 19, 2014
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Glass Frit Wafer Bond Protective Structure
- Publication number 20130285228
- Publication date Oct 31, 2013
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING A MICRO-ELECTRO-MECHANICAL-SYSTEMS (MEMS) DEVICE
- Publication number 20120107993
- Publication date May 3, 2012
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH ISOLATED MICROSTRUCTURES AND MET...
- Publication number 20100155861
- Publication date Jun 24, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa Z. Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ruben B. Montez

Person

Patents Grantslast 30 patents

Rough MEMS surface

Method for selective etching using dry film photoresist

Reducing MEMS stiction by deposition of nanoclusters

Etch release residue removal using anhydrous solution

Bonded wafer structure having cavities with low pressure and method...

Reducing MEMS stiction by increasing surface roughness

Reducing MEMS stiction by introduction of a carbon barrier

Systems and methods for anchoring components in MEMS semiconductor...

Method of making a MEMS die having a MEMS device on a suspended str...

Reducing MEMS stiction by deposition of nanoclusters

Glass frit wafer bond protective structure

Through substrate via with diffused conductive component

Reducing MEMS stiction by deposition of nanoclusters

Reducing microelectromechanical systems stiction by formation of a...

Reducing MEMS stiction by introduction of a carbon barrier

Glass frit wafer bond protective structure

Substrate bonding with metal germanium silicon material

Method of making a micro-electro-mechanical-systems (MEMS) device

Substrate bonding with metal germanium silicon material

Method of producing microelectromechanical device with isolated mic...

Patents Applicationslast 30 patents

ROUGH MEMS SURFACE

BONDED WAFER STRUCTURE HAVING CAVITIES WITH LOW PRESSURE AND METHOD...

FABRICATION METHOD FOR SUSPENDED MEMS DEVICE

GLASS FRIT WAFER BOND PROTECTIVE STRUCTURE

REDUCING MEMS STICTION BY INCREASING SURFACE ROUGHNESS

REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS

REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS

ETCH RELEASE RESIDUE REMOVAL USING ANHYDROUS SOLUTION

REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER

REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A...

REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS

REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER

Glass Frit Wafer Bond Protective Structure

METHOD OF MAKING A MICRO-ELECTRO-MECHANICAL-SYSTEMS (MEMS) DEVICE

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

MICROELECTROMECHANICAL DEVICE WITH ISOLATED MICROSTRUCTURES AND MET...