Ruben Madrid

Person

Talisay City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
SiP substrate
- Patent number 8,372,690
- Issue date Feb 12, 2013
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced thin semiconductor package
- Patent number 8,193,622
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with clip interconnection
- Patent number 8,193,618
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiP substrate
- Patent number 7,893,548
- Issue date Feb 22, 2011
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including leadframe with die attach pad w...
- Patent number 7,821,116
- Issue date Oct 26, 2010
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with dual exposed surfaces and method...
- Patent number 7,816,178
- Issue date Oct 19, 2010
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling integrated power device package and module with a...
- Patent number 7,663,211
- Issue date Feb 16, 2010
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with dual exposed surfaces and method...
- Patent number 7,576,429
- Issue date Aug 18, 2009
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded frame carrier for MOSFET BGA
- Patent number 7,402,462
- Issue date Jul 22, 2008
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier with metal bumps for semiconductor die packages
- Patent number 7,023,077
- Issue date Apr 4, 2006
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier with metal bumps for semiconductor die packages
- Patent number 6,893,901
- Issue date May 17, 2005
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making power chip scale package
- Patent number 6,861,286
- Issue date Mar 1, 2005
- Fairchild Semiconductor Corporation
- Maria Cristina B. Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including drain clip
- Patent number 6,777,800
- Issue date Aug 17, 2004
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power chip scale package
- Patent number 6,646,329
- Issue date Nov 11, 2003
- Fairchild Semiconductor, Inc.
- Maria Cristina B. Estacio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20110244633
- Publication date Oct 6, 2011
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiP SUBSTRATE
- Publication number 20110133318
- Publication date Jun 9, 2011
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD W...
- Publication number 20110008935
- Publication date Jan 13, 2011
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20100164078
- Publication date Jul 1, 2010
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
- Publication number 20100155913
- Publication date Jun 24, 2010
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CLIP INTERCONNECTION
- Publication number 20100148327
- Publication date Jun 17, 2010
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH DUAL EXPOSED SURFACES AND METHOD...
- Publication number 20090269885
- Publication date Oct 29, 2009
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiP SUBSTRATE
- Publication number 20090236702
- Publication date Sep 24, 2009
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
- Publication number 20090057852
- Publication date Mar 5, 2009
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
- Publication number 20090057855
- Publication date Mar 5, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD W...
- Publication number 20080185696
- Publication date Aug 7, 2008
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND ME...
- Publication number 20080023807
- Publication date Jan 31, 2008
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor device with dual exposed surfaces and method...
- Publication number 20070161151
- Publication date Jul 12, 2007
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded frame carrier for MOSFET BGA
- Publication number 20070015316
- Publication date Jan 18, 2007
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier with metal bumps for semiconductor die packages
- Publication number 20060131747
- Publication date Jun 22, 2006
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier with metal bumps for semiconductor die packages
- Publication number 20040232542
- Publication date Nov 25, 2004
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power chip scale package
- Publication number 20040130011
- Publication date Jul 8, 2004
- Fairchild Semiconductor Corporation
- Maria Cristina B. Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package including drain clip
- Publication number 20040063240
- Publication date Apr 1, 2004
- Fairchild Semiconductor Corporation
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power chip scale package
- Publication number 20020171126
- Publication date Nov 21, 2002
- Maria Cristina B. Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier with metal bumps for semiconductor die packages
- Publication number 20020167075
- Publication date Nov 14, 2002
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS

Ruben Madrid

Person

Patents Grantslast 30 patents

SiP substrate

Thermally enhanced thin semiconductor package

Semiconductor die package with clip interconnection

SiP substrate

Semiconductor die package including leadframe with die attach pad w...

Packaged semiconductor device with dual exposed surfaces and method...

Dual side cooling integrated power device package and module with a...

Packaged semiconductor device with dual exposed surfaces and method...

Folded frame carrier for MOSFET BGA

Carrier with metal bumps for semiconductor die packages

Carrier with metal bumps for semiconductor die packages

Method for making power chip scale package

Semiconductor die package including drain clip

Power chip scale package

Patents Applicationslast 30 patents

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

SiP SUBSTRATE

SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD W...

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE WITH CLIP INTERCONNECTION

PACKAGED SEMICONDUCTOR DEVICE WITH DUAL EXPOSED SURFACES AND METHOD...

SiP SUBSTRATE

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD W...

DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND ME...

Packaged semiconductor device with dual exposed surfaces and method...

Folded frame carrier for MOSFET BGA

Carrier with metal bumps for semiconductor die packages

Carrier with metal bumps for semiconductor die packages

Power chip scale package

Semiconductor die package including drain clip

Power chip scale package

Carrier with metal bumps for semiconductor die packages