Rudolf Berger

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Selective thermal annealing method
- Patent number 11,581,418
- Issue date Feb 14, 2023
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a template wafer
- Patent number 11,557,505
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer composite and method for producing a semiconductor component
- Patent number 10,784,145
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer composite and method for producing semiconductor components
- Patent number 10,651,072
- Issue date May 12, 2020
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by bonding a semicond...
- Patent number 10,431,504
- Issue date Oct 1, 2019
- Infineon Technologies Austria AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 9,613,805
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Werner Schustereder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional material containing electronic components
- Patent number 9,590,044
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Guenther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 9,576,844
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Grant
Trench capacitors and methods of forming the same
- Patent number 9,508,790
- Issue date Nov 29, 2016
- Infineon Technologies AG
- Thomas Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer for bonding and encapsulating an SiC-based function...
- Patent number 9,349,804
- Issue date May 24, 2016
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core
- Patent number 9,252,045
- Issue date Feb 2, 2016
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 9,236,290
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 9,224,633
- Issue date Dec 29, 2015
- Infineon Technologies AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Grant
Compound structure and method for forming a compound structure
- Patent number 9,219,049
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a power semiconductor device
- Patent number 9,171,728
- Issue date Oct 27, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitors and methods of forming the same
- Patent number 9,111,781
- Issue date Aug 18, 2015
- Infineon Technologies AG
- Thomas Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 8,822,306
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Grant
Power semiconductor device and a method for forming a semiconductor...
- Patent number 8,786,012
- Issue date Jul 22, 2014
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and a method for forming a semiconductor...
- Patent number 8,748,974
- Issue date Jun 10, 2014
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved on-resistance
- Patent number 8,741,736
- Issue date Jun 3, 2014
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using a sacrificial layer
- Patent number 8,535,993
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Reinhard Goellner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved on-resistance
- Patent number 8,502,315
- Issue date Aug 6, 2013
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite wafer having a graphite core,...
- Patent number 8,404,562
- Issue date Mar 26, 2013
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved on-resistance
- Patent number 8,198,678
- Issue date Jun 12, 2012
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor including a foreign material l...
- Patent number 7,947,569
- Issue date May 24, 2011
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Selective Laser Annealing Method
- Publication number 20230155000
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Thermal Annealing Method
- Publication number 20210384318
- Publication date Dec 9, 2021
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20210013090
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Composite and Method for Producing a Semiconductor Component
- Publication number 20190244853
- Publication date Aug 8, 2019
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Composite and Method for Producing Semiconductor Components
- Publication number 20190244850
- Publication date Aug 8, 2019
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...
- Publication number 20190221533
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20180047619
- Publication date Feb 15, 2018
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices by Bonding a Semicond...
- Publication number 20160260699
- Publication date Sep 8, 2016
- Infineon Technologies Austria AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer Having a SiC-Based Functional Layer
- Publication number 20160225856
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20160086842
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Composite Wafer having a Graphite Core,...
- Publication number 20160086844
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer Having a Graphite Core
- Publication number 20150279941
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Capacitors and Methods of Forming the Same
- Publication number 20150263083
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound Structure and Method for Forming a Compound Structure
- Publication number 20150171045
- Publication date Jun 18, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE,...
- Publication number 20140335676
- Publication date Nov 13, 2014
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Application
TWO-DIMENSIONAL MATERIAL CONTAINING ELECTRONIC COMPONENTS
- Publication number 20140306184
- Publication date Oct 16, 2014
- INFINEON TECHNOLOGIES AG
- Guenther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Power Semiconductor Device
- Publication number 20140235058
- Publication date Aug 21, 2014
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer and a Method for Manufacturing Same
- Publication number 20140225125
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Composite Wafer Having a Graphite Core,...
- Publication number 20140070232
- Publication date Mar 13, 2014
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE
- Publication number 20130323897
- Publication date Dec 5, 2013
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Capacitors and Methods of Forming the Same
- Publication number 20130221483
- Publication date Aug 29, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20120289023
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and a Method for Forming a Semiconductor...
- Publication number 20120286355
- Publication date Nov 15, 2012
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE
- Publication number 20120217580
- Publication date Aug 30, 2012
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Composite Wafer Having a Graphite Core,...
- Publication number 20120083098
- Publication date Apr 5, 2012
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for Manufacturing a Composite Wafer Having a Graphite Core,...
- Publication number 20120080690
- Publication date Apr 5, 2012
- Infineon Technologies Austria AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method using a Sacrificial Layer
- Publication number 20120068240
- Publication date Mar 22, 2012
- Reinhard Goellner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE
- Publication number 20110133272
- Publication date Jun 9, 2011
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor and Method for Making Same
- Publication number 20110073990
- Publication date Mar 31, 2011
- Rudolf BERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR INCLUDING A MATERIAL LAYER
- Publication number 20090325361
- Publication date Dec 31, 2009
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS

Rudolf Berger

Person

Patents Grantslast 30 patents

Selective thermal annealing method

Method of manufacturing a template wafer

Wafer composite and method for producing a semiconductor component

Wafer composite and method for producing semiconductor components

Method of manufacturing semiconductor devices by bonding a semicond...

Method for forming a semiconductor device

Two-dimensional material containing electronic components

Method for manufacturing a composite wafer having a graphite core,...

Trench capacitors and methods of forming the same

Composite wafer for bonding and encapsulating an SiC-based function...

Method for manufacturing a composite wafer having a graphite core

Method for producing a semiconductor device

Method for manufacturing a composite wafer having a graphite core,...

Compound structure and method for forming a compound structure

Method for forming a power semiconductor device

Trench capacitors and methods of forming the same

Method for manufacturing a composite wafer having a graphite core,...

Power semiconductor device and a method for forming a semiconductor...

Power semiconductor device and a method for forming a semiconductor...

Semiconductor device with improved on-resistance

Semiconductor device and method using a sacrificial layer

Semiconductor device with improved on-resistance

Method for manufacturing a composite wafer having a graphite core,...

Semiconductor device with improved on-resistance

Method for producing a semiconductor including a foreign material l...

Patents Applicationslast 30 patents

Selective Laser Annealing Method

Selective Thermal Annealing Method

METHOD OF MANUFACTURING A TEMPLATE WAFER

Wafer Composite and Method for Producing a Semiconductor Component

Wafer Composite and Method for Producing Semiconductor Components

SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...

METHOD OF MANUFACTURING A TEMPLATE WAFER

Method of Manufacturing Semiconductor Devices by Bonding a Semicond...

Composite Wafer Having a SiC-Based Functional Layer

Method for Producing a Semiconductor Device

Method for Manufacturing a Composite Wafer having a Graphite Core,...

Composite Wafer Having a Graphite Core

Trench Capacitors and Methods of Forming the Same

Compound Structure and Method for Forming a Compound Structure

METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE,...

TWO-DIMENSIONAL MATERIAL CONTAINING ELECTRONIC COMPONENTS

Method for Forming a Power Semiconductor Device

Composite Wafer and a Method for Manufacturing Same

Method for Manufacturing a Composite Wafer Having a Graphite Core,...

SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE

Trench Capacitors and Methods of Forming the Same

Method for Producing a Semiconductor Device

Power Semiconductor Device and a Method for Forming a Semiconductor...

SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE

Method for Manufacturing a Composite Wafer Having a Graphite Core,...

Method for Manufacturing a Composite Wafer Having a Graphite Core,...

Semiconductor Device and Method using a Sacrificial Layer

SEMICONDUCTOR DEVICE WITH IMPROVED ON-RESISTANCE

Capacitor and Method for Making Same

METHOD FOR PRODUCING A SEMICONDUCTOR INCLUDING A MATERIAL LAYER