Rudolf Lehner

Person

Laaber, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a template wafer
- Patent number 11,557,505
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor wafers using a grinding wheel
- Patent number 10,974,365
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor devices
- Patent number 10,710,210
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Rudolf Lehner
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for controlling a movement of a grinding wheel, semicondu...
- Patent number 10,307,884
- Issue date Jun 4, 2019
- Infineon Technologies AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic chip device with mounting provision and ext...
- Patent number 9,536,816
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector module and method of manufacturing the same
- Patent number 7,766,560
- Issue date Aug 3, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MID module and a method of mounting an optical fibre in an MID module
- Patent number 7,597,484
- Issue date Oct 6, 2009
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Cyrus Ghahremani
- G02 - OPTICS
Information Patent Grant
Radiofrequency power semiconductor module with cavity housing, and...
- Patent number 7,417,198
- Issue date Aug 26, 2008
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for singulating and bonding semiconductor chips, and meth...
- Patent number 7,259,088
- Issue date Aug 21, 2007
- Infineon Technologies AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration and method for contacting circuit structure
- Patent number 7,245,026
- Issue date Jul 17, 2007
- Infineon Technologies AG
- Rudolf Lehner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component having a semiconductor chip and method for pop...
- Patent number 6,906,428
- Issue date Jun 14, 2005
- Infineon Technologies AG
- Rudolf Lehner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for populating transport tapes
- Patent number 6,895,731
- Issue date May 24, 2005
- Infineon Technologies AG
- Rudolf Lehner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Radio-frequency power component, radio-frequency power module, meth...
- Patent number 6,867,492
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for populating transport tapes
- Patent number 6,694,707
- Issue date Feb 24, 2004
- Infineon Technologies AG
- Rudolf Lehner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20210013090
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing Semiconductor Wafers Using a Grinding Wheel
- Publication number 20200298369
- Publication date Sep 24, 2020
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Devices
- Publication number 20190275638
- Publication date Sep 12, 2019
- Rudolf Lehner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING A TEMPLATE WAFER
- Publication number 20180047619
- Publication date Feb 15, 2018
- INFINEON TECHNOLOGIES AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Controlling a Movement of a Grinding Wheel, Semicondu...
- Publication number 20180021919
- Publication date Jan 25, 2018
- INFINEON TECHNOLOGIES AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated electronic chip device with mounting provision and ext...
- Publication number 20160035658
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector module and method of manufacturing the same
- Publication number 20080160828
- Publication date Jul 3, 2008
- Jochen Dangelmaier
- G02 - OPTICS
Information Patent Application
MID MODULE AND A METHOD OF MOUNTING AN OPTICAL FIBRE IN AN MID MODULE
- Publication number 20080152285
- Publication date Jun 26, 2008
- Avago Technologies, Ltd.
- Cyrus Ghahremani
- G02 - OPTICS
Information Patent Application
Apparatus for singulating and bonding semiconductor chips, and meth...
- Publication number 20060065967
- Publication date Mar 30, 2006
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a semiconductor component with contacts situ...
- Publication number 20060014326
- Publication date Jan 19, 2006
- Infineon Technologies AG
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency power semiconductor module with a hollow housing and...
- Publication number 20060012016
- Publication date Jan 19, 2006
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component having a semiconductor chip and method for pop...
- Publication number 20040089935
- Publication date May 13, 2004
- Rudolf Lehner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for populating transport tapes
- Publication number 20040079055
- Publication date Apr 29, 2004
- Infineon Technologies AG
- Rudolf Lehner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio-frequency power component, radio-frequency power module, meth...
- Publication number 20030155661
- Publication date Aug 21, 2003
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for populating transport tapes
- Publication number 20030136087
- Publication date Jul 24, 2003
- Rudolf Lehner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component with contacts situated at the underside, an...
- Publication number 20030015774
- Publication date Jan 23, 2003
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration and method for the contacting of circuits
- Publication number 20020173081
- Publication date Nov 21, 2002
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS

Rudolf Lehner

Person

Patents Grantslast 30 patents

Method of manufacturing a template wafer

Method for processing semiconductor wafers using a grinding wheel

Method for forming semiconductor devices

Apparatus for controlling a movement of a grinding wheel, semicondu...

Encapsulated electronic chip device with mounting provision and ext...

Connector module and method of manufacturing the same

MID module and a method of mounting an optical fibre in an MID module

Radiofrequency power semiconductor module with cavity housing, and...

Apparatus for singulating and bonding semiconductor chips, and meth...

Configuration and method for contacting circuit structure

Electronic component having a semiconductor chip and method for pop...

Apparatus for populating transport tapes

Radio-frequency power component, radio-frequency power module, meth...

Apparatus and method for populating transport tapes

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A TEMPLATE WAFER

Method for Processing Semiconductor Wafers Using a Grinding Wheel

Method for Forming Semiconductor Devices

METHOD OF MANUFACTURING A TEMPLATE WAFER

Apparatus for Controlling a Movement of a Grinding Wheel, Semicondu...

Encapsulated electronic chip device with mounting provision and ext...

Connector module and method of manufacturing the same

MID MODULE AND A METHOD OF MOUNTING AN OPTICAL FIBRE IN AN MID MODULE

Apparatus for singulating and bonding semiconductor chips, and meth...

Method for fabricating a semiconductor component with contacts situ...

High-frequency power semiconductor module with a hollow housing and...

Electronic component having a semiconductor chip and method for pop...

Apparatus for populating transport tapes

Radio-frequency power component, radio-frequency power module, meth...

Apparatus and method for populating transport tapes

Semiconductor component with contacts situated at the underside, an...

Configuration and method for the contacting of circuits