Rudolf Zelsacher

Person

Klagenfurt, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for exposing a structure on a substrate
- Patent number 10,670,972
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Rudolf Zelsacher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,887,152
- Issue date Feb 6, 2018
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,673,157
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate and a method of process screening...
- Patent number 9,406,572
- Issue date Aug 2, 2016
- Infineon Technologies AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,397,055
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with integrated crack sensor and method for...
- Patent number 9,343,381
- Issue date May 17, 2016
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing a semiconductor co...
- Patent number 9,171,950
- Issue date Oct 27, 2015
- Infineon Technologies AG
- Andrew Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing a semiconductor co...
- Patent number 9,142,444
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,030,028
- Issue date May 12, 2015
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,029,200
- Issue date May 12, 2015
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,362,551
- Issue date Jan 29, 2013
- Infineon Technologies Austria AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing a semiconductor co...
- Patent number 8,269,282
- Issue date Sep 18, 2012
- Infineon Technologies AG
- Andrew Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchoring structure and intermeshing structure
- Patent number 8,084,865
- Issue date Dec 27, 2011
- Infineon Technologies AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with trench field plate including first and se...
- Patent number 8,044,459
- Issue date Oct 25, 2011
- Infineon Technologies Austria AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistor and method for manufacturing a field-effect...
- Patent number 8,030,703
- Issue date Oct 4, 2011
- Infineon Technologies AG
- Dietmar Kotz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing it
- Patent number 7,863,680
- Issue date Jan 4, 2011
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection electrode for two semiconductor z...
- Patent number 7,851,349
- Issue date Dec 14, 2010
- Infineon Technologies Austria AG
- Walter Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench transistor and method for fabricating a trench transistor
- Patent number 7,790,550
- Issue date Sep 7, 2010
- Infineon Technologies AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor device
- Patent number 7,612,408
- Issue date Nov 3, 2009
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with trench transistors and method for manufac...
- Patent number 7,601,596
- Issue date Oct 13, 2009
- Infineon Technologies Austria AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing it
- Patent number 7,446,373
- Issue date Nov 4, 2008
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench transistor and method for fabricating a trench transistor
- Patent number 7,414,286
- Issue date Aug 19, 2008
- Infineon Technologies AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor for a MOS circuit configuration
- Patent number 6,948,847
- Issue date Sep 27, 2005
- Infineon Technologies AG
- Eric Pihet
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensionally embodied circuit with electrically connected se...
- Patent number 6,661,086
- Issue date Dec 9, 2003
- Infineon Technologies AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an EEPROM memory cell with a trench capacitor
- Patent number 6,410,391
- Issue date Jun 25, 2002
- Infineon Technologies AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer Chuck, Use of the Wafer Chuck and Method for Testing a Semico...
- Publication number 20180082882
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Rudolf Zelsacher
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
PROCESSING OF THICK METAL PADS
- Publication number 20160307858
- Publication date Oct 20, 2016
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Detecting a Crack in a Semiconductor Body of a Semicondu...
- Publication number 20160254200
- Publication date Sep 1, 2016
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND A METHOD OF PROCESS SCREENING...
- Publication number 20160126149
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Exposing a Structure on a Substrate
- Publication number 20150362841
- Publication date Dec 17, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Zelsacher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Processing of Thick Metal Pads
- Publication number 20150348921
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20150243592
- Publication date Aug 27, 2015
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Integrated Crack Sensor and Method for...
- Publication number 20140346509
- Publication date Nov 27, 2014
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20140284819
- Publication date Sep 25, 2014
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...
- Publication number 20130323905
- Publication date Dec 5, 2013
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component and Method for Producing a Semiconductor Co...
- Publication number 20120309147
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Andrew Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR THE PRODUCTION OF A SEMICONDUCT...
- Publication number 20120025303
- Publication date Feb 2, 2012
- Infineon Technologies Austria AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20120013029
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Electrode for Two Semiconductor Z...
- Publication number 20110294289
- Publication date Dec 1, 2011
- Infineon Technologies Austria AG
- Walter Reiger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component and Method for Producing a Semiconductor Co...
- Publication number 20110147843
- Publication date Jun 23, 2011
- INFINEON TECHNOLOGIES AG
- Andrew Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR THE PRODUCTION OF A SEMICONDUCT...
- Publication number 20100117144
- Publication date May 13, 2010
- Infineon Technologies Austria AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method for producing a semiconductor co...
- Publication number 20100078716
- Publication date Apr 1, 2010
- Erwin Bacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH TRANSISTOR AND METHOD FOR FABRICATING A TRENCH TRANSISTOR
- Publication number 20090206401
- Publication date Aug 20, 2009
- INFINEON TECHNOLOGIES AG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anchoring Structure and Intermeshing Structure
- Publication number 20080265427
- Publication date Oct 30, 2008
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING IT
- Publication number 20080265318
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING A FIELD-EFFECT...
- Publication number 20080211019
- Publication date Sep 4, 2008
- INFINEON TECHNOLOGIES AG
- Dietmar Kotz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with trench transistors and method for manufac...
- Publication number 20080116511
- Publication date May 22, 2008
- Infineon Technologies Austria AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH TRANSISTOR AND METHOD FOR FABRICATING A TRENCH TRANSISTOR
- Publication number 20070114600
- Publication date May 24, 2007
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a connection electrode for two semiconductor z...
- Publication number 20070093019
- Publication date Apr 26, 2007
- Infineon Technologies Austria AG
- Walter Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and micromechanical structure
- Publication number 20050194662
- Publication date Sep 8, 2005
- Infineon Technologies AG
- Gerhard Schmidt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOS transistor device
- Publication number 20050116267
- Publication date Jun 2, 2005
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method for producing it
- Publication number 20050110077
- Publication date May 26, 2005
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for setting the threshold voltage of a field-effect transist...
- Publication number 20040027877
- Publication date Feb 12, 2004
- Dietmar Kotz
- G11 - INFORMATION STORAGE
Information Patent Application
Temperature sensor for a MOS circuit configuration
- Publication number 20030210507
- Publication date Nov 13, 2003
- Eric Pihet
- G01 - MEASURING TESTING
Information Patent Application
Three-dimensionally embodied circuit with electrically connected se...
- Publication number 20020163067
- Publication date Nov 7, 2002
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS

Rudolf Zelsacher

Person

Patents Grantslast 30 patents

Method and apparatus for exposing a structure on a substrate

Method for manufacturing semiconductor devices having a metallisati...

Processing of thick metal pads

Method for processing a substrate and a method of process screening...

Processing of thick metal pads

Semiconductor component with integrated crack sensor and method for...

Semiconductor component and method for producing a semiconductor co...

Semiconductor component and method for producing a semiconductor co...

Method for manufacturing semiconductor devices having a metallisati...

Method for manufacturing semiconductor devices having a metallisati...

Semiconductor device

Semiconductor component and method for producing a semiconductor co...

Anchoring structure and intermeshing structure

Semiconductor device with trench field plate including first and se...

Field-effect transistor and method for manufacturing a field-effect...

Semiconductor component and method for producing it

Method for producing a connection electrode for two semiconductor z...

Trench transistor and method for fabricating a trench transistor

MOS transistor device

Semiconductor device with trench transistors and method for manufac...

Semiconductor component and method for producing it

Trench transistor and method for fabricating a trench transistor

Temperature sensor for a MOS circuit configuration

Three-dimensionally embodied circuit with electrically connected se...

Method for producing an EEPROM memory cell with a trench capacitor

Patents Applicationslast 30 patents

Wafer Chuck, Use of the Wafer Chuck and Method for Testing a Semico...

PROCESSING OF THICK METAL PADS

Method for Detecting a Crack in a Semiconductor Body of a Semicondu...

METHOD FOR PROCESSING A SUBSTRATE AND A METHOD OF PROCESS SCREENING...

Method and Apparatus for Exposing a Structure on a Substrate

Processing of Thick Metal Pads

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

Semiconductor Component with Integrated Crack Sensor and Method for...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...

Semiconductor Component and Method for Producing a Semiconductor Co...

SEMICONDUCTOR DEVICE AND METHOD FOR THE PRODUCTION OF A SEMICONDUCT...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

Method for Producing a Connection Electrode for Two Semiconductor Z...

Semiconductor Component and Method for Producing a Semiconductor Co...

SEMICONDUCTOR DEVICE AND METHOD FOR THE PRODUCTION OF A SEMICONDUCT...

Semiconductor component and method for producing a semiconductor co...

TRENCH TRANSISTOR AND METHOD FOR FABRICATING A TRENCH TRANSISTOR

Anchoring Structure and Intermeshing Structure

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING IT

FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING A FIELD-EFFECT...

Semiconductor device with trench transistors and method for manufac...

TRENCH TRANSISTOR AND METHOD FOR FABRICATING A TRENCH TRANSISTOR

Method for producing a connection electrode for two semiconductor z...

Semiconductor component and micromechanical structure

MOS transistor device

Semiconductor component and method for producing it

Method for setting the threshold voltage of a field-effect transist...

Temperature sensor for a MOS circuit configuration

Three-dimensionally embodied circuit with electrically connected se...