Rudolphus H. Hoefs

Person

Eindhoven, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Positional error compensation in assembly of discrete components by...
- Patent number 12,046,504
- Issue date Jul 23, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component placement systems and methods of operating the same
- Patent number 11,612,089
- Issue date Mar 21, 2023
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
- Patent number 11,557,567
- Issue date Jan 17, 2023
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems, and methods of attaching a die to a substrate
- Patent number 11,410,870
- Issue date Aug 9, 2022
- Assembleon B.V.
- Roy Brewel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant die attach systems having spring-driven bond tools
- Patent number 11,134,595
- Issue date Sep 28, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems, and methods of attaching a die to a substrate
- Patent number 11,069,555
- Issue date Jul 20, 2021
- Assembleon B.V.
- Roy Brewel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20230189493
- Publication date Jun 15, 2023
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE COMPONENTS BY...
- Publication number 20220236557
- Publication date Jul 28, 2022
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20220183198
- Publication date Jun 9, 2022
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20210392802
- Publication date Dec 16, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE
- Publication number 20210313215
- Publication date Oct 7, 2021
- Assembleon B.V.
- Roy Brewel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20200077550
- Publication date Mar 5, 2020
- Assembleon B.V.
- Rudolphus H. Hoefs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE
- Publication number 20200075385
- Publication date Mar 5, 2020
- Assembleon B.V.
- Roy Brewel
- H01 - BASIC ELECTRIC ELEMENTS

Rudolphus H. Hoefs

Person

Patents Grantslast 30 patents

Positional error compensation in assembly of discrete components by...

Component placement systems and methods of operating the same

Methods of attaching die to substrate using compliant die attach sy...

Die attach systems, and methods of attaching a die to a substrate

Compliant die attach systems having spring-driven bond tools

Die attach systems, and methods of attaching a die to a substrate

Patents Applicationslast 30 patents

COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME

POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE COMPONENTS BY...

COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

DIE ATTACH SYSTEMS, AND METHODS OF ATTACHING A DIE TO A SUBSTRATE