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Rudra Kar
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Mesa, AZ, US
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last 30 patents
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Patent Grant
Leaded grid array IC package having coplanar bent leads for surface...
Patent number
6,016,852
Issue date
Jan 25, 2000
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Molding technique for molding plastic packages
Patent number
5,665,296
Issue date
Sep 9, 1997
Intel Corporation
Praveen Jain
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL