Ruedi Grueter

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Neuenkirch, CH

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for placing a semiconductor chip as a flipchip on a subst...
- Patent number 7,020,954
- Issue date Apr 4, 2006
- ESEC Trading SA
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and/or wire bonder with a device for holding down a subs...
- Patent number 6,585,145
- Issue date Jul 1, 2003
- ESEC Trading SA
- Stefan Behler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for placing a semiconductor chip as a flipchip on a subst...
- Publication number 20020162217
- Publication date Nov 7, 2002
- ESEC Trading SA, a Swiss Corporation
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die bonder and/or wire bonder with a device for holding down a subs...
- Publication number 20020066765
- Publication date Jun 6, 2002
- Stefan Behler
- H01 - BASIC ELECTRIC ELEMENTS