Ruediger Schmolke

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Burghausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for machining a semiconductor wafer on both sides in a carri...
- Patent number 7,541,287
- Issue date Jun 2, 2009
- Siltronic AG
- Ruediger Schmolke
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for machining a semiconductor wafer on both sides in a carri...
- Publication number 20070021042
- Publication date Jan 25, 2007
- Siltronic AG
- Ruediger Schmolke
- B24 - GRINDING POLISHING