Rui-Feng Tai

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,610,850
- Issue date Mar 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,289,346
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 10,741,500
- Issue date Aug 11, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20230187382
- Publication date Jun 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220189900
- Publication date Jun 16, 2022
- Siliconware Precision Industries Co., Ltd.
- Chia-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220173052
- Publication date Jun 2, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200335447
- Publication date Oct 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190237374
- Publication date Aug 1, 2019
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING STRUCTURE HAVING POSITIONING UNIT
- Publication number 20190109092
- Publication date Apr 11, 2019
- Siliconware Precision Industries Co., Ltd.
- Rui-Feng Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160005695
- Publication date Jan 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Rui-Feng Tai
- H01 - BASIC ELECTRIC ELEMENTS

Rui-Feng Tai

Person

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Method for fabricating electronic package

Electronic package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

POSITIONING STRUCTURE HAVING POSITIONING UNIT

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF