Rui MA

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structures including backside vias
- Patent number 11,791,331
- Issue date Oct 17, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less FinFET diode architectures with backside metal conta...
- Patent number 11,652,107
- Issue date May 16, 2023
- Intel Corporation
- Nicholas Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors with dual thickness gate dielectrics
- Patent number 11,145,732
- Issue date Oct 12, 2021
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20230402449
- Publication date Dec 14, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...
- Publication number 20220415881
- Publication date Dec 29, 2022
- Intel Corporation
- Rui MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220415925
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...
- Publication number 20220416022
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...
- Publication number 20220415877
- Publication date Dec 29, 2022
- Intel Corporation
- Benjamin Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...
- Publication number 20220415880
- Publication date Dec 29, 2022
- Intel Corporation
- Ayan KAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220102385
- Publication date Mar 31, 2022
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20220077140
- Publication date Mar 10, 2022
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20210202472
- Publication date Jul 1, 2021
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH DUAL THICKNESS GATE DIELECTRICS
- Publication number 20210167180
- Publication date Jun 3, 2021
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS FINFET DIODE ARCHITECTURES WITH BACKSIDE METAL CONTA...
- Publication number 20200403007
- Publication date Dec 24, 2020
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit structures including backside vias

Substrate-less FinFET diode architectures with backside metal conta...

Field-effect transistors with dual thickness gate dielectrics

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...

SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES

SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...

ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...

SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...

SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

FIELD-EFFECT TRANSISTORS WITH DUAL THICKNESS GATE DIELECTRICS

SUBSTRATE-LESS FINFET DIODE ARCHITECTURES WITH BACKSIDE METAL CONTA...