Rui Yuan XING

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 11,342,185
- Issue date May 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device flipping apparatus
- Patent number 11,257,706
- Issue date Feb 22, 2022
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma activation treatment for wafer bonding
- Patent number 10,790,260
- Issue date Sep 29, 2020
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 10,679,854
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20200273706
- Publication date Aug 27, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ACTIVATION TREATMENT FOR WAFER BONDING
- Publication number 20200212004
- Publication date Jul 2, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FLIPPING APPARATUS
- Publication number 20200126838
- Publication date Apr 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20190051524
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS