Rui YUAN

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate component layout and bonding method for increased package...
- Patent number 11,810,896
- Issue date Nov 7, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flatness detection device
- Patent number 11,493,333
- Issue date Nov 8, 2022
- Shanghai Fusion Tech Co., Ltd.
- Xi Cao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for adjusting height of a 3D printer nozzle
- Patent number 11,059,218
- Issue date Jul 13, 2021
- Shanghai Fusion Tech Co., Ltd.
- Xi Cao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS
- Publication number 20240332156
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Optimized Underfill Flow
- Publication number 20230299034
- Publication date Sep 21, 2023
- Western Digital Technologies, Inc.
- Yihao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Component Layout and Bonding Method for Increased Package...
- Publication number 20220375896
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Jiandi DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
- Publication number 20220285316
- Publication date Sep 8, 2022
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
- Publication number 20220093559
- Publication date Mar 24, 2022
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATNESS DETECTION DEVICE
- Publication number 20210172734
- Publication date Jun 10, 2021
- SHANGHAI FUSION TECH CO., LTD.
- Xi CAO
- G01 - MEASURING TESTING