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Rui Zhang
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Cupertino, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
11,694,960
Issue date
Jul 4, 2023
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a first level interface
Patent number
11,322,290
Issue date
May 3, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
11,133,257
Issue date
Sep 28, 2021
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
11,031,360
Issue date
Jun 8, 2021
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
10,777,514
Issue date
Sep 15, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
10,475,745
Issue date
Nov 12, 2019
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
10,103,103
Issue date
Oct 16, 2018
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
9,640,485
Issue date
May 2, 2017
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
9,147,663
Issue date
Sep 29, 2015
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of estimating sampling clock offset, a sampling clock offset...
Patent number
8,767,855
Issue date
Jul 1, 2014
Greenvity Communications, Inc.
Rui Zhang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20240014138
Publication date
Jan 11, 2024
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
Publication number
20230197659
Publication date
Jun 22, 2023
Intel Corporation
Mukund Ayalasomayajula
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
Publication number
20220230800
Publication date
Jul 21, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20210384129
Publication date
Dec 9, 2021
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
Publication number
20200373257
Publication date
Nov 26, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20200043852
Publication date
Feb 6, 2020
Intel Corporation
Yueli Liu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
Publication number
20190385780
Publication date
Dec 19, 2019
Intel Corporation
Cheng Xu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
Publication number
20190385959
Publication date
Dec 19, 2019
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20190013271
Publication date
Jan 10, 2019
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20170207168
Publication date
Jul 20, 2017
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20150364423
Publication date
Dec 17, 2015
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20140353827
Publication date
Dec 4, 2014
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ESTIMATING SAMPLING CLOCK OFFSET, A SAMPLING CLOCK OFFSET...
Publication number
20130266056
Publication date
Oct 10, 2013
Greenvity Communications, Inc.
Rui Zhang
H04 - ELECTRIC COMMUNICATION TECHNIQUE