Rung-Je Yang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical planarization composition for polishing oxide m...
- Patent number 11,718,767
- Issue date Aug 8, 2023
- VERSUM MATERIALS US, LLC
- Ming-Shih Tsai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...
- Publication number 20240006189
- Publication date Jan 4, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shared Data Induced Quality Control For A Chemical Mechanical Plana...
- Publication number 20230325751
- Publication date Oct 12, 2023
- VERSUM MATERIALS US, LLC
- Cesar Clavero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low Dishing Copper Chemical Mechanical Planarization
- Publication number 20220332978
- Publication date Oct 20, 2022
- VERSUM MATERIALS US, LLC
- KEH-YEUAN LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical Mechanical Planarization Composition For Polishing Oxide M...
- Publication number 20200048551
- Publication date Feb 13, 2020
- VERSUM MATERIALS US, LLC
- Ming-Shih Tsai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...