Rung-Jeng Lin

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of a tip part and a tip part for an endoscope
- Patent number 11,432,714
- Issue date Sep 6, 2022
- Ambu A/S
- Thomas Bachgaard Jensen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,380,978
- Issue date Jul 5, 2022
- Siliconware Precision Industries Co., Ltd.
- Shi-Min Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,289,794
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Rung-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,101,566
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,756,438
- Issue date Aug 25, 2020
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endoscope with a T-shaped flexible circuit board
- Patent number 9,622,649
- Issue date Apr 18, 2017
- Ambu A/S
- Rung-De Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Endoscope with a flexible circuit board
- Patent number 9,572,482
- Issue date Feb 21, 2017
- Ambu A/S
- Rung-De Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145908
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Chun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20210203057
- Publication date Jul 1, 2021
- Siliconware Precision Industries Co., Ltd.
- Rung-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200343641
- Publication date Oct 29, 2020
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200258871
- Publication date Aug 13, 2020
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING MODULE OF MEDICAL ENDOSCOPE AND THE METHOD OF MAKING THE SAME
- Publication number 20200196840
- Publication date Jun 25, 2020
- LIMIT OPTICS CO., LTD.
- RUNG DE LIN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Lighting Module of Medical Endoscope and the Method of Making the Same
- Publication number 20200196848
- Publication date Jun 25, 2020
- Limit Optics Co., Ltd.
- RUNG DE LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR MANUFACTURE OF A TIP PART AND A TIP PART FOR AN ENDOSCOPE
- Publication number 20200100663
- Publication date Apr 2, 2020
- AMBU A/S
- Thomas Bachgaard JENSEN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...
- Publication number 20200043908
- Publication date Feb 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Chee-Key Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190273321
- Publication date Sep 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190123424
- Publication date Apr 25, 2019
- Siliconware Precision Industries Co., Ltd.
- Shi-Min Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180288886
- Publication date Oct 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDOSCOPE WITH A T-SHAPED FLEXIBLE CIRCUIT BOARD
- Publication number 20140210976
- Publication date Jul 31, 2014
- LIMIT OPTICS CO., LTD.
- Rung-De LIN
- G02 - OPTICS
Information Patent Application
ENDOSCOPE WITH A FLEXIBLE CIRCUIT BOARD
- Publication number 20130035546
- Publication date Feb 7, 2013
- Rung-De LIN
- G02 - OPTICS

Rung-Jeng Lin

Person

Patents Grantslast 30 patents

Package stack structure and method for manufacturing the same

Method for manufacture of a tip part and a tip part for an endoscope

Electronic package and method for fabricating the same

Electronic package

Method for fabricating electronic package

Electronic package and method for fabricating the same

Endoscope with a T-shaped flexible circuit board

Endoscope with a flexible circuit board

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LIGHTING MODULE OF MEDICAL ENDOSCOPE AND THE METHOD OF MAKING THE SAME

Lighting Module of Medical Endoscope and the Method of Making the Same

METHOD FOR MANUFACTURE OF A TIP PART AND A TIP PART FOR AN ENDOSCOPE

PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ENDOSCOPE WITH A T-SHAPED FLEXIBLE CIRCUIT BOARD

ENDOSCOPE WITH A FLEXIBLE CIRCUIT BOARD