RunLing LI

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
FDSOI device structure and preparation method thereof
- Patent number 11,855,212
- Issue date Dec 26, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FDSOI device structure and preparation method thereof
- Patent number 11,569,385
- Issue date Jan 31, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a CMOS device
- Patent number 11,398,410
- Issue date Jul 26, 2022
- Shanghai Huali Integrated Circuit Corporation
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor device with improved NBTI and a method of ma...
- Patent number 11,335,605
- Issue date May 17, 2022
- Shanghai Huali Integrated Circuit Corporation
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FDSOI device structure and preparation method thereof
- Patent number 11,302,780
- Issue date Apr 12, 2022
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric fuse structure for optimizing programming current window o...
- Patent number 10,886,216
- Issue date Jan 5, 2021
- SHANGHAI HUALI INTEGRATED CIRCUIT MFG. CO., LTD.
- Yanwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for reducing dislocation defects in high concen...
- Patent number 10,868,144
- Issue date Dec 15, 2020
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for reducing dislocation defects in high concen...
- Patent number 10,332,979
- Issue date Jun 25, 2019
- Shanghai Huali Microelectronics Corporation
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the gate with the LELE double pattern
- Patent number 9,171,731
- Issue date Oct 27, 2015
- Shanghai Huali Microelectronics Corporation
- Jun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless reflow process for bump formation
- Patent number 7,838,411
- Issue date Nov 23, 2010
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tsing-Chow Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20230126031
- Publication date Apr 27, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20220093799
- Publication date Mar 24, 2022
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20220093738
- Publication date Mar 24, 2022
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAINED SEMICONDUCTOR DEVICE WITH IMPROVED NBTI AND A METHOD OF MA...
- Publication number 20210159125
- Publication date May 27, 2021
- Shanghai Huali Integrated Circuit Corporation
- Runling LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CMOS DEVICE
- Publication number 20210143066
- Publication date May 13, 2021
- Shanghai Huali Integrated Circuit Corporation
- Runling LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC FUSE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200035600
- Publication date Jan 30, 2020
- Shanghai Huali Integrated Circuit Mfg. Co., Ltd.
- Yanwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR REDUCING DISLOCATION DEFECTS IN HIGH CONCEN...
- Publication number 20190267472
- Publication date Aug 29, 2019
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR REDUCING DISLOCATION DEFECTS IN HIGH CONCEN...
- Publication number 20170062583
- Publication date Mar 2, 2017
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Runling Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FIN FIELD EFFECT TRANSISTOR
- Publication number 20160322476
- Publication date Nov 3, 2016
- Shanghai Huali Microelectronics Corporation
- Ningbo Sang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THE GATE WITH THE LELE DOUBLE PATTERN
- Publication number 20150050801
- Publication date Feb 19, 2015
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Jun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless Reflow Process for Bump Formation
- Publication number 20080128476
- Publication date Jun 5, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tsing-Chow Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

FDSOI device structure and preparation method thereof

FDSOI device structure and preparation method thereof

Method for manufacturing a CMOS device

Strained semiconductor device with improved NBTI and a method of ma...

FDSOI device structure and preparation method thereof

Electric fuse structure for optimizing programming current window o...

Methods and systems for reducing dislocation defects in high concen...

Methods and systems for reducing dislocation defects in high concen...

Method of forming the gate with the LELE double pattern

Fluxless reflow process for bump formation

Patents Applicationslast 30 patents

FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF

FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF

FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF

STRAINED SEMICONDUCTOR DEVICE WITH IMPROVED NBTI AND A METHOD OF MA...

METHOD FOR MANUFACTURING A CMOS DEVICE

ELECTRIC FUSE STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHODS AND SYSTEMS FOR REDUCING DISLOCATION DEFECTS IN HIGH CONCEN...

METHODS AND SYSTEMS FOR REDUCING DISLOCATION DEFECTS IN HIGH CONCEN...

METHOD OF MANUFACTURING A FIN FIELD EFFECT TRANSISTOR

METHOD OF FORMING THE GATE WITH THE LELE DOUBLE PATTERN

Fluxless Reflow Process for Bump Formation