Runsheng Mao

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Clinton, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder paste as thermal interface material
- Patent number 11,581,239
- Issue date Feb 14, 2023
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials having increased mobility after heating
- Patent number 10,010,981
- Issue date Jul 3, 2018
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
- Publication number 20200230750
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL
- Publication number 20200235033
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS HAVING INCREASED MOBILITY AFTER HEATING
- Publication number 20090084469
- Publication date Apr 2, 2009
- Indium Corporation of America
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR