Rushik Prabhudas Tank

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermal dissipation feature and...
- Patent number 11,817,366
- Issue date Nov 14, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
- Patent number 11,557,525
- Issue date Jan 17, 2023
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,222,790
- Issue date Jan 11, 2022
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
- Publication number 20230106555
- Publication date Apr 6, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
- Publication number 20220384299
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220344235
- Publication date Oct 27, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220181230
- Publication date Jun 9, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20220093416
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20210202267
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS