TREA

Russ Lie

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  • Phoenix, AZ, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-level circuit substrate fabrication method
    • Patent number 8,316,536
    • Issue date Nov 27, 2012
    • Amkor Technology, Inc.
    • Ronald Patrick Huemoeller
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Two-sided fan-out wafer escape package
    • Patent number 7,692,286
    • Issue date Apr 6, 2010
    • Amkor Technology, Inc.
    • Ronald Patrick Huemoeller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Two-sided wafer escape package
    • Patent number 7,420,272
    • Issue date Sep 2, 2008
    • Amkor Technology, Inc.
    • Ronald Patrick Huemoeller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Two-sided wafer escape package
    • Patent number 7,247,523
    • Issue date Jul 24, 2007
    • Amkor Technology, Inc.
    • Ronald Patrick Huemoeller
    • H01 - BASIC ELECTRIC ELEMENTS